Integrated Circuits (ICs)

PIC16LF18855-E/SO

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Microchip Technology

IC MCU 8BIT 14KB FLASH 28SOIC

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Integrated Circuits (ICs)

PIC16LF18855-E/SO

Active

Microchip Technology

IC MCU 8BIT 14KB FLASH 28SOIC

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	PIC16LF18855-E/SO

Connectivity	I2C, LINbus, UART/USART, SPI
Core Processor	PIC
Core Size	8-Bit
Data Converters [custom]	10, 5
Data Converters [custom]	1, 24
EEPROM Size	256 x 8
Mounting Type	Surface Mount
Number of I/O	25
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	28-SOIC
Package / Case [x]	0.295 in
Package / Case [y]	7.5 mm
Program Memory Size	14 KB
Program Memory Type	FLASH
RAM Size	1 K
Speed	32 MHz
Supplier Device Package	28-SOIC
Voltage - Supply (Vcc/Vdd) [Max]	3.6 V
Voltage - Supply (Vcc/Vdd) [Min]	1.8 V

PIC16LF18855 Series

Part	Package / Case	Package / Case	Package / Case	RAM Size	Oscillator Type	Number of I/O	Data Converters [custom]	Data Converters [custom]	Operating Temperature [Max]	Operating Temperature [Min]	Supplier Device Package	Core Processor	Program Memory Type	Connectivity	EEPROM Size	Program Memory Size	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	Speed	Core Size	Mounting Type	Package / Case [custom]	Package / Case [custom]	Package / Case [x]	Package / Case [y]
Microchip Technology PIC16LF18855-I/SP	0.3 in	28-DIP	7.62 mm	1 K	Internal	25	5 10	1 24	85 °C	-40 °C	28-SPDIP	PIC	FLASH	I2C LINbus SPI UART/USART	256 x 8	14 KB	1.8 V	3.6 V	32 MHz	8-Bit	Through Hole
Microchip Technology PIC16F18855-I/SS		28-SSOP		1 K	Internal	25	5 10	1 24	85 °C	-40 °C	28-SSOP	PIC	FLASH	I2C LINbus SPI UART/USART	256 x 8	14 KB	2.3 V	5.5 V	32 MHz	8-Bit	Surface Mount	0.209 in	5.3 mm
Microchip Technology PIC16F18855-E/MV		28-UFQFN Exposed Pad		1 K	Internal	25	5 10	1 24	125 °C	-40 °C	28-UQFN (4x4)	PIC	FLASH	I2C LINbus SPI UART/USART	256 x 8	14 KB	2.3 V	5.5 V	32 MHz	8-Bit	Surface Mount
Microchip Technology PIC16LF18855-E/ML		28-VQFN Exposed Pad		1 K	Internal	25	5 10	1 24	125 °C	-40 °C	28-QFN (6x6)	PIC	FLASH	I2C LINbus SPI UART/USART	256 x 8	14 KB	1.8 V	3.6 V	32 MHz	8-Bit	Surface Mount
Microchip Technology PIC16LF18855T-I/SO		28-SOIC		1 K	Internal	25	5 10	1 24	85 °C	-40 °C	28-SOIC	PIC	FLASH	I2C LINbus SPI UART/USART	256 x 8	14 KB	1.8 V	3.6 V	32 MHz	8-Bit	Surface Mount			0.295 in	7.5 mm
Microchip Technology PIC16F18855T-I/MV		28-UFQFN Exposed Pad		1 K	Internal	25	5 10	1 24	85 °C	-40 °C	28-UQFN (4x4)	PIC	FLASH	I2C LINbus SPI UART/USART	256 x 8	14 KB	2.3 V	5.5 V	32 MHz	8-Bit	Surface Mount
Microchip Technology PIC16LF18855-E/SO		28-SOIC		1 K	Internal	25	5 10	1 24	125 °C	-40 °C	28-SOIC	PIC	FLASH	I2C LINbus SPI UART/USART	256 x 8	14 KB	1.8 V	3.6 V	32 MHz	8-Bit	Surface Mount			0.295 in	7.5 mm
Microchip Technology PIC16LF18855T-I/MV		28-UFQFN Exposed Pad		1 K	Internal	25	5 10	1 24	85 °C	-40 °C	28-UQFN (4x4)	PIC	FLASH	I2C LINbus SPI UART/USART	256 x 8	14 KB	1.8 V	3.6 V	32 MHz	8-Bit	Surface Mount
Microchip Technology PIC16LF18855-I/SS		28-SSOP		1 K	Internal	25	5 10	1 24	85 °C	-40 °C	28-SSOP	PIC	FLASH	I2C LINbus SPI UART/USART	256 x 8	14 KB	1.8 V	3.6 V	32 MHz	8-Bit	Surface Mount	0.209 in	5.3 mm
Microchip Technology PIC16F18855-I/SP	0.3 in	28-DIP	7.62 mm	1 K	Internal	25	5 10	1 24	85 °C	-40 °C	28-SPDIP	PIC	FLASH	I2C LINbus SPI UART/USART	256 x 8	14 KB	2.3 V	5.5 V	32 MHz	8-Bit	Through Hole

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

PIC16LF18855 Series

PIC16(L)F1885X/7X microcontrollers feature Analog, Core Independent Peripherals and communication peripherals, combined with eXtreme Low Power (XLP) for a wide range of general purpose and low-power applications. The family features the CRC/SCAN, HLT and Windowed WDT to support customers looking to add safety to their application. Additionally, this family includes up to 56 KB of Flash memory, along with a 10-bit ADC with Computation (ADC2) for automated signal analysis to reduce the complexity of the application.

***Demonstration Platform***

Internet of Things Sensor Badge with interactive control via motion, multiple sensors, RGB LEDs and bluetooth communication.

Documents

Technical documentation and resources