Himalaya uSLIC power modules leverage advanced packaging technology to shrink the power supply solution size by 2.25 times, resulting in micro-sized system-level IC (uSLIC) devices. This is achieved by integrating a synchronous wide-input Himalaya buck converter—which includes built-in FETs, compensation, and additional functions—with an inductor. The combination of these components results in ultra-small power modules that can be used in highly space-constrained systems while complying with the JESD22-B103/B104/B111 mechanical standard. In addition, compliance with the CISPR 22 electromagnetic interference (EMI) standard helps to improve the first-time success rate for EMI certification of your end products.