R5F2L36CCDFP#31

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Renesas Electronics Corporation

16-BIT MICROCONTROLLERS WITH R8C CPU CORE (NON PROMOTION)

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Integrated Circuits (ICs)

R5F2L36CCDFP#31

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Renesas Electronics Corporation

16-BIT MICROCONTROLLERS WITH R8C CPU CORE (NON PROMOTION)

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Technical Specifications

Parameters and characteristics for this part

Specification	R5F2L36CCDFP#31

Connectivity	I2C, LINbus, UART/USART, SSU, SIO
Core Processor	R8C
Core Size	16-Bit
Data Converters	A/D 10x10b, D/A 2x8b
EEPROM Size	4K x 8
Mounting Type	Surface Mount
Number of I/O	52
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	External, Internal
Package / Case	64-LQFP
Program Memory Size	128 KB
Program Memory Type	FLASH
RAM Size	10 K
Speed	20 MHz
Supplier Device Package	64-LFQFP (10x10)
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	1.8 V

R8C/L36C Series

16-bit Microcontrollers with R8C CPU Core (Non Promotion)

Part	Supplier Device Package	Program Memory Size	Core Size	Mounting Type	Data Converters	EEPROM Size	Core Processor	Number of I/O	RAM Size	Program Memory Type	Package / Case	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	Oscillator Type	Connectivity	Operating Temperature [Min]	Operating Temperature [Max]	Speed
Renesas Electronics Corporation R5F2L36CCNFP#31	64-LFQFP (10x10)	128 KB	16-Bit	Surface Mount	A/D 10x10b D/A 2x8b	4K x 8	R8C	52	10 K	FLASH	64-LQFP	1.8 V	5.5 V	External Internal	I2C LINbus SIO SSU UART/USART	-20 °C	85 C	20 MHz
Renesas Electronics Corporation R5F2L36CCDFP#31	64-LFQFP (10x10)	128 KB	16-Bit	Surface Mount	A/D 10x10b D/A 2x8b	4K x 8	R8C	52	10 K	FLASH	64-LQFP	1.8 V	5.5 V	External Internal	I2C LINbus SIO SSU UART/USART	-40 °C	85 °C	20 MHz
Renesas Electronics Corporation R5F2L368CDFP#V2	64-LFQFP (10x10)	64 KB	16-Bit	Surface Mount	A/D 10x10b D/A 2x8b	4K x 8	R8C	52	8 K	FLASH	64-LQFP	1.8 V	5.5 V	Internal	I2C LINbus SIO SSU UART/USART	-40 °C	85 °C	20 MHz
Renesas Electronics Corporation R5F2L368ANFP#U1	64-LFQFP (10x10)	64 KB	16-Bit	Surface Mount	A/D 10x10b D/A 2x8b	4K x 8	R8C	52	8 K	FLASH	64-LQFP	1.8 V	5.5 V	Internal	I2C LINbus SIO SSU UART/USART	-20 °C	85 C	20 MHz
Renesas Electronics Corporation R5F2L367CNFP#31	64-LFQFP (10x10)	48 KB	16-Bit	Surface Mount	A/D 10x10b D/A 2x8b	4K x 8	R8C	52	6 K	FLASH	64-LQFP	1.8 V	5.5 V	External Internal	I2C LINbus SIO SSU UART/USART	-20 °C	85 C	20 MHz
Renesas Electronics Corporation R5F2L36ACNFP#31	64-LFQFP (10x10)	96 KB	16-Bit	Surface Mount	A/D 10x10b D/A 2x8b	4K x 8	R8C	52	10 K	FLASH	64-LQFP	1.8 V	5.5 V	External Internal	I2C LINbus SIO SSU UART/USART	-20 °C	85 C	20 MHz
Renesas Electronics Corporation R5F2L368CNFA#31	64-LQFP (14x14)	64 KB	16-Bit	Surface Mount	A/D 10x10b D/A 2x8b	4K x 8	R8C	52	8 K	FLASH	64-LQFP	1.8 V	5.5 V	External Internal	I2C LINbus SIO SSU UART/USART	-20 °C	85 C	20 MHz
Renesas Electronics Corporation R5F2L368CDFP#31	64-LFQFP (10x10)	64 KB	16-Bit	Surface Mount	A/D 10x10b D/A 2x8b	4K x 8	R8C	52	8 K	FLASH	64-LQFP	1.8 V	5.5 V	Internal	I2C LINbus SIO SSU UART/USART	-40 °C	85 °C	20 MHz
Renesas Electronics Corporation R5F2L36CCDFA#31	64-LQFP (14x14)	128 KB	16-Bit	Surface Mount	A/D 10x10b D/A 2x8b	4K x 8	R8C	52	10 K	FLASH	64-LQFP	1.8 V	5.5 V	External Internal	I2C LINbus SIO SSU UART/USART	-40 °C	85 °C	20 MHz
Renesas Electronics Corporation R5F2L367ADFP#U1	64-LQFP (14x14)	48 KB	16-Bit	Surface Mount	A/D 10x10b D/A 2x8b	4K x 8	R8C	52	6 K	FLASH	64-LQFP	1.8 V	5.5 V	Internal	I2C LINbus SIO SSU UART/USART	-40 °C	85 °C	20 MHz

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	320	$ 5.71

Description

General part information

R8C/L36C Series

The R8C/L36C Group is supported only for customers who have already adopted these products. The RL78/L12, RL78/L13 Groups are recommended for new designs.

The R8C/L35M Group, R8C/L36M Group, R8C/L38M Group, and R8C/L3AM Group of single-chip MCUs incorporate the R8C CPU core, which implements a powerful instruction set for a high level of efficiency and supports a 1Mb address space, allowing execution of instructions at high speed. In addition, the CPU core integrates a multiplier for high-speed operation processing.

Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, helps reduce the number of system components. These groups have data flash (1KB × 4 blocks) with the background operation (BGO) function.

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