Integrated Circuits (ICs)

AGL125V2-CSG196

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ULTRA LOW DENSITY FPGAS

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Integrated Circuits (ICs)

Active

ULTRA LOW DENSITY FPGAS

Technical Specifications

Parameters and characteristics for this part

Specification	AGL125V2-CSG196

Mounting Type	Surface Mount
Number of Gates	125000
Number of I/O	133
Number of Logic Elements/Cells	3072
Operating Temperature [Max]	70 °C
Operating Temperature [Min]	0 °C
Package / Case	CSBGA, 196-TFBGA
Supplier Device Package	196-CSP (8x8)
Voltage - Supply [Max]	1.575 V
Voltage - Supply [Min]	1.14 V

Ultra Low Density FPGAs

Part	Number of I/O	Package / Case	Number of Logic Elements/Cells	Operating Temperature [Max]	Operating Temperature [Min]	Number of Gates	Mounting Type	Voltage - Supply [Max]	Voltage - Supply [Min]	Supplier Device Package
Microchip Technology AGL125V2-FG144I	97	144-LBGA	3072	85 °C	-40 °C	125000	Surface Mount	1.575 V	1.14 V	13x13 144-FPBGA
Microchip Technology AGL125V2-CS196	133	196-TFBGA CSBGA	3072	70 °C	0 °C	125000	Surface Mount	1.575 V	1.14 V	196-CSP (8x8)
Microchip Technology AGL125V5-FG144	97	144-LBGA	3072	70 °C	0 °C	125000	Surface Mount	1.575 V	1.425 V	13x13 144-FPBGA
Microchip Technology AGL125V2-CSG196	133	196-TFBGA CSBGA	3072	70 °C	0 °C	125000	Surface Mount	1.575 V	1.14 V	196-CSP (8x8)
Microchip Technology AGL125V2-VQG100	71	100-TQFP	3072	70 °C	0 °C	125000	Surface Mount	1.575 V	1.14 V	100-VQFP (14x14)
Microchip Technology AGL125V5-FG144I	97	144-LBGA	3072	85 °C	-40 °C	125000	Surface Mount	1.575 V	1.425 V	13x13 144-FPBGA
Microchip Technology AGL125V2-VQ100I	71	100-TQFP	3072	85 °C	-40 °C	125000	Surface Mount	1.575 V	1.14 V	100-VQFP (14x14)
Microchip Technology AGL125V2-VQ100	71	100-TQFP	3072	70 °C	0 °C	125000	Surface Mount	1.575 V	1.14 V	100-VQFP (14x14)
Microchip Technology AGL125V5-FGG144I	97	144-LBGA	3072	85 °C	-40 °C	125000	Surface Mount	1.575 V	1.425 V	13x13 144-FPBGA
Microchip Technology AGL125V5-CS196	133	196-TFBGA CSBGA	3072	70 °C	0 °C	125000	Surface Mount	1.575 V	1.425 V	196-CSP (8x8)

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General part information

IGLOO

offers the lowest power FPGA, small footprint packages, reprogrammability,

and an abundance of features.

Technical documentation and resources