Connectors, Interconnects

1981837-1

Obsolete

CONN SOCKET LGA 1366POS GOLD

Search across all available documentation for this part.

Connectors, Interconnects

Obsolete

CONN SOCKET LGA 1366POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	1981837-1

Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	15 µin
Contact Finish Thickness - Mating	0.38 µm
Contact Material - Mating	Copper Alloy
Contact Material - Post [custom]	Copper Alloy
Features	Open Frame
Housing Material	Thermoplastic
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions or Pins (Grid) [custom]	1366
Number of Positions or Pins (Grid) [custom]	41
Number of Positions or Pins (Grid) [custom]	32
Pitch - Mating	1.02 mm
Pitch - Mating	0.04 in
Pitch - Post	0.04 in
Pitch - Post	1.01 mm
Termination	Solder
Type	LGA

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Pitch - Post	Pitch - Post	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Material Flammability Rating	Type	Mounting Type	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Housing Material	Features	Contact Material - Post [custom]
TE Connectivity Raychem Cable Protection 1981837-1	15 µin	0.38 µm	Solder	0.04 in	1.01 mm	Gold	1366	41	32	UL94 V-0	LGA	Surface Mount	Copper Alloy	1.02 mm	0.04 in	Thermoplastic	Open Frame	Copper Alloy
TE Connectivity Raychem Cable Protection 1-1981837-2	30 Áin	0.76 Ám	Solder	0.04 in	1.01 mm	Gold	1366	41	32	UL94 V-0	LGA	Surface Mount	Copper Alloy	1.02 mm	0.04 in	Thermoplastic	Open Frame

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

1366 (32 x 41) Pos LGA Socket Gold Surface Mount

Technical documentation and resources