
AIMCQ120R080M1TXTMA1
ActiveSIC MOSFETS TAILORED TO ADDRESS OBC/DC-DC APPLICATIONS FOR 800V AUTOMOTIVE ARCHITECTURE

AIMCQ120R080M1TXTMA1
ActiveSIC MOSFETS TAILORED TO ADDRESS OBC/DC-DC APPLICATIONS FOR 800V AUTOMOTIVE ARCHITECTURE
Technical Specifications
Parameters and characteristics for this part
| Specification | AIMCQ120R080M1TXTMA1 |
|---|---|
| Current - Continuous Drain (Id) (Tc) | 34 A |
| Drain to Source Voltage (Vdss) | 1200 V |
| Drive Voltage (Max Rds On) | 18 V |
| Drive Voltage (Min Rds On) | 20 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 24 nC |
| Grade | Automotive |
| Input Capacitance (Ciss) (Max) | 671 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 175 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 22-PowerBSOP Module |
| Package Name | PG-HDSOP-22 |
| Power Dissipation (Max) | 211 W |
| Qualification | AEC-Q101 |
| Rds On (Max) | 100 mOhm |
| Technology | SiCFET (Silicon Carbide) |
| Vgs (Max) Negative | -10 V |
| Vgs (Max) Positive | 25 V |
| Vgs(th) (Max) | 5.1 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
CAD
3D models and CAD resources for this part
Description
General part information
1200V G1 Series
The CoolSiC™ Automotive MOSFET 1200 V in Q-DPAK package is tailored to address OBC/DC-DC applications for 800V Automotive architecture. Leveraging Top-Side-Cooling (TSC) technology, it can provide customers with an outstanding thermal performance, easier assembly and reduced system cost. Compared to back-side cooling, TSC provides an optimized PCB assembly, thus eliminating parasitic effects and providing much lower stray inductances.
Documents
Technical documentation and resources