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Discrete Semiconductor Products

RQ3E180BNTB1

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Rohm Semiconductor

NCH 30V 39A MIDDLE POWER MOSFET:

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Discrete Semiconductor Products

RQ3E180BNTB1

Active
Rohm Semiconductor

NCH 30V 39A MIDDLE POWER MOSFET:

Technical Specifications

Parameters and characteristics for this part

SpecificationRQ3E180BNTB1
Current - Continuous Drain (Id) @ 25°C39 A, 18 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs72 nC
Input Capacitance (Ciss) (Max) @ Vds3500 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerVDFN
Power Dissipation (Max)2 W, 20 W
Rds On (Max) @ Id, Vgs3.9 mOhm
Supplier Device Package [custom]8-HSMT
Supplier Device Package [x]3.2
Supplier Device Package [y]3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.00
10$ 1.29
100$ 0.92
500$ 0.78
1000$ 0.74
Digi-Reel® 1$ 2.00
10$ 1.29
100$ 0.92
500$ 0.78
1000$ 0.74
N/A 2808$ 1.83
Tape & Reel (TR) 3000$ 0.62

Description

General part information

RQ3E180 Series

RQ3E180BN is low on-resistance and high power package MOSFET for switching application.

Documents

Technical documentation and resources

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Create Symbols for PSpice Models

Models

Part Explanation

Application Note

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Constitution Materials List

Environmental Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

What Is Thermal Design

Thermal Design

HSMT8(TB1) Dimension

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

ESD Data

Characteristics Data

Anti-Whisker formation - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Export Regulations

Export Information

Compliance of the RoHS directive

Environmental Data

Types and Features of Transistors

Application Note

List of Transistor Package Thermal Resistance

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

PCB Layout Thermal Design Guide

Thermal Design

HSMT8(TB1) Taping Information

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

HSMT8(TB1) Explanation for Marking

Package Information

Moisture Sensitivity Level - Transistors

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

HSMT8 Single Cu Inner Structure

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

RQ3E180BN Data Sheet

Data Sheet