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Discrete Semiconductor Products

2SCR586D3FRATL

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Rohm Semiconductor

NPN, TO-252 (DPAK), 80V 5A, POWER TRANSISTOR FOR AUTOMOTIVE

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Product dimension image
Discrete Semiconductor Products

2SCR586D3FRATL

Active
Rohm Semiconductor

NPN, TO-252 (DPAK), 80V 5A, POWER TRANSISTOR FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

Specification2SCR586D3FRATL
Current - Collector (Ic) (Max) [Max]5 A
Current - Collector Cutoff (Max) [Max]1 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]120
Frequency - Transition200 MHz
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power - Max [Max]10 W
QualificationAEC-Q101
Supplier Device PackageTO-252
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic300 mV
Voltage - Collector Emitter Breakdown (Max) [Max]80 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.87
10$ 1.55
100$ 1.23
500$ 1.04
1000$ 0.89
Digi-Reel® 1$ 1.87
10$ 1.55
100$ 1.23
500$ 1.04
1000$ 0.89
N/A 6171$ 2.67
Tape & Reel (TR) 2500$ 0.84
5000$ 0.81
12500$ 0.78
NewarkEach (Supplied on Cut Tape) 1$ 1.94
10$ 1.54
25$ 1.39
50$ 1.26
100$ 1.11
250$ 1.01
500$ 0.91
1000$ 0.84

Description

General part information

2SCR586 Series

2SCR586JFRG is a power transistor with Low VCE(sat), suitable for low frequency amplifier.

Documents

Technical documentation and resources

Method for Monitoring Switching Waveform

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

How to Create Symbols for PSpice Models

Models

What Is Thermal Design

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Export Regulations

Export Information

Types and Features of Transistors

Application Note

How to Use LTspice® Models

Schematic Design & Verification

2SCR586D3 Thermal Resistance

Characteristics Data

Package Dimensions

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

2SCR586D3FRA ESD Data

Characteristics Data

List of Transistor Package Thermal Resistance

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

2SCR586D3FRA Data Sheet

Data Sheet

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Part Explanation

Application Note

Condition of Soldering / Land Pattern Reference

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Explanation for Marking

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

TO-252_TL Taping Information

Package Information

Inner Structure

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

About Flammability of Materials

Environmental Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Technical Data Sheet EN

Datasheet