Connectors, Interconnects

XR2A-2001-N

Obsolete

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 20POS GOLD

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Connectors, Interconnects

XR2A-2001-N

Obsolete

Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 20POS GOLD

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	XR2A-2001-N

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Post	30 µin
Contact Finish Thickness - Post	0.76 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	20 mOhm
Current Rating (Amps)	1 A
Features	Open Frame
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	20
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length [x]	3.2 mm
Termination Post Length [x]	0.126 in
Type	7.62 mm
Type	0.3 in
Type	DIP

XR2A Series

Part	Contact Resistance	Current Rating (Amps)	Termination Post Length [x]	Termination Post Length [x]	Material Flammability Rating	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Termination	Pitch - Post	Pitch - Post	Features	Number of Positions or Pins (Grid)	Type	Type	Type	Type [custom]	Type [custom]	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Contact Material - Post [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Mating [custom]	Contact Finish Thickness - Mating [custom]	Contact Finish Thickness - Post
Omron Electronics Inc-EMC Div XR2A-2001-N	20 mOhm	1 A	3.2 mm	0.126 in	UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled	30 µin	0.76 µm	Beryllium Copper	Beryllium Copper	0.1 "	2.54 mm	Gold	0.76 Ám	30 Áin	Gold	Solder	0.1 in	2.54 mm	Open Frame	20	7.62 mm	0.3 in	DIP
Omron Electronics Inc-EMC Div XR2A-3211-N	20 mOhm	1 A	3.2 mm	0.126 in	UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled	10 Áin	0.25 çm	Beryllium Copper	Beryllium Copper	0.1 "	2.54 mm	Gold	0.25 µm	10 µin	Gold	Solder	0.1 in	2.54 mm	Open Frame	32			DIP	15.24 mm	0.6 in
Omron Electronics Inc-EMC Div XR2A-0815	20 mOhm	1 A			UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled	10 Áin	0.25 çm		Beryllium Copper	0.1 "	2.54 mm	Gold	0.25 µm	10 µin	Gold	Solder	0.1 in	2.54 mm	Open Frame	8	7.62 mm	0.3 in	DIP			2.23 mm	0.088 in	2	4	Brass
Omron Electronics Inc-EMC Div XR2A-1611-N	20 mOhm	1 A	3.2 mm	0.126 in	UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled	10 Áin	0.25 çm	Beryllium Copper	Beryllium Copper	0.1 "	2.54 mm	Gold	0.25 µm	10 µin	Gold	Solder	0.1 in	2.54 mm	Open Frame	16	7.62 mm	0.3 in	DIP								2	8
Omron Electronics Inc-EMC Div XR2A-2201-N	20 mOhm	1 A			UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled		29.5 µin		Beryllium Copper	0.1 "	2.54 mm	Gold			Gold	Solder	0.1 in	2.54 mm	Open Frame	22		0.4 in	DIP			3.5 mm	0.138 in	2	11	Brass			29.5 µin	0.75 µm	0.75 µm
Omron Electronics Inc-EMC Div XR2A-2801-N	20 mOhm	1 A	3.2 mm	0.126 in	UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled	30 µin	0.76 µm	Beryllium Copper	Beryllium Copper	0.1 "	2.54 mm	Gold	0.76 Ám	30 Áin	Gold	Solder	0.1 in	2.54 mm	Open Frame	28			DIP	15.24 mm	0.6 in
Omron Electronics Inc-EMC Div XR2A-0811-N	20 mOhm	1 A	3.2 mm	0.126 in	UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled	10 Áin	0.25 çm	Beryllium Copper	Beryllium Copper	0.1 "	2.54 mm	Gold	0.25 µm	10 µin	Gold	Solder	0.1 in	2.54 mm	Open Frame	8	7.62 mm	0.3 in	DIP					2	4
Omron Electronics Inc-EMC Div XR2A-3201-N	20 mOhm	1 A	3.2 mm	0.126 in	UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled	30 µin	0.76 µm	Beryllium Copper	Beryllium Copper	0.1 "	2.54 mm	Gold	0.76 Ám	30 Áin	Gold	Solder	0.1 in	2.54 mm	Open Frame	32			DIP	15.24 mm	0.6 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 3.28