XR2A Series

Manufacturer: Omron Electronics Inc-EMC Div

Catalog

CONN IC DIP SOCKET 20POS GOLD

Part	Contact Resistance	Current Rating (Amps)	Termination Post Length [x]	Termination Post Length [x]	Material Flammability Rating	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Termination	Pitch - Post	Pitch - Post	Features	Number of Positions or Pins (Grid)	Type	Type	Type	Type [custom]	Type [custom]	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Contact Material - Post [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Mating [custom]	Contact Finish Thickness - Mating [custom]	Contact Finish Thickness - Post
Omron Electronics Inc-EMC Div XR2A-2001-N	20 mOhm	1 A	3.2 mm	0.126 in	UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled	30 µin	0.76 µm	Beryllium Copper	Beryllium Copper	0.1 "	2.54 mm	Gold	0.76 Ám	30 Áin	Gold	Solder	0.1 in	2.54 mm	Open Frame	20	7.62 mm	0.3 in	DIP
Omron Electronics Inc-EMC Div XR2A-3211-N	20 mOhm	1 A	3.2 mm	0.126 in	UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled	10 Áin	0.25 çm	Beryllium Copper	Beryllium Copper	0.1 "	2.54 mm	Gold	0.25 µm	10 µin	Gold	Solder	0.1 in	2.54 mm	Open Frame	32			DIP	15.24 mm	0.6 in
Omron Electronics Inc-EMC Div XR2A-0815	20 mOhm	1 A			UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled	10 Áin	0.25 çm		Beryllium Copper	0.1 "	2.54 mm	Gold	0.25 µm	10 µin	Gold	Solder	0.1 in	2.54 mm	Open Frame	8	7.62 mm	0.3 in	DIP			2.23 mm	0.088 in	2	4	Brass
Omron Electronics Inc-EMC Div XR2A-1611-N	20 mOhm	1 A	3.2 mm	0.126 in	UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled	10 Áin	0.25 çm	Beryllium Copper	Beryllium Copper	0.1 "	2.54 mm	Gold	0.25 µm	10 µin	Gold	Solder	0.1 in	2.54 mm	Open Frame	16	7.62 mm	0.3 in	DIP								2	8
Omron Electronics Inc-EMC Div XR2A-2201-N	20 mOhm	1 A			UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled		29.5 µin		Beryllium Copper	0.1 "	2.54 mm	Gold			Gold	Solder	0.1 in	2.54 mm	Open Frame	22		0.4 in	DIP			3.5 mm	0.138 in	2	11	Brass			29.5 µin	0.75 µm	0.75 µm
Omron Electronics Inc-EMC Div XR2A-2801-N	20 mOhm	1 A	3.2 mm	0.126 in	UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled	30 µin	0.76 µm	Beryllium Copper	Beryllium Copper	0.1 "	2.54 mm	Gold	0.76 Ám	30 Áin	Gold	Solder	0.1 in	2.54 mm	Open Frame	28			DIP	15.24 mm	0.6 in
Omron Electronics Inc-EMC Div XR2A-0811-N	20 mOhm	1 A	3.2 mm	0.126 in	UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled	10 Áin	0.25 çm	Beryllium Copper	Beryllium Copper	0.1 "	2.54 mm	Gold	0.25 µm	10 µin	Gold	Solder	0.1 in	2.54 mm	Open Frame	8	7.62 mm	0.3 in	DIP					2	4
Omron Electronics Inc-EMC Div XR2A-3201-N	20 mOhm	1 A	3.2 mm	0.126 in	UL94 V-0	Through Hole	-55 C	125 °C	Polybutylene Terephthalate (PBT) Glass Filled	30 µin	0.76 µm	Beryllium Copper	Beryllium Copper	0.1 "	2.54 mm	Gold	0.76 Ám	30 Áin	Gold	Solder	0.1 in	2.54 mm	Open Frame	32			DIP	15.24 mm	0.6 in