Zenode.ai Logo
Beta
Log InSign Up
676 FBGA Top
Integrated Circuits (ICs)

M1A3PE1500-2FGG676I

Active
Microchip Technology

PROASIC3 FPGA, ARM CORTEX-M1, 16KLES 676 PBGA 27X27X2.44MM TRAY ROHS COMPLIANT: YES

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsProduct Change Notice EN
676 FBGA Top
Integrated Circuits (ICs)

M1A3PE1500-2FGG676I

Active
Microchip Technology

PROASIC3 FPGA, ARM CORTEX-M1, 16KLES 676 PBGA 27X27X2.44MM TRAY ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsProduct Change Notice EN

Technical Specifications

Parameters and characteristics for this part

SpecificationM1A3PE1500-2FGG676I
Mounting TypeSurface Mount
Number of Gates1500000
Number of I/O444
Operating Temperature [Max]100 °C
Operating Temperature [Min]-40 C
Package / Case676-BGA
Supplier Device Package676-FBGA (27x27)
Total RAM Bits276480 bits
Voltage - Supply [Max]1.575 V
Voltage - Supply [Min]1.425 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 40$ 325.64
Microchip DirectTRAY 1$ 325.64
50$ 320.54
250$ 306.19
500$ 284.92
1000$ 166.79
5000$ 156.60
NewarkEach 1$ 325.64
50$ 320.54
250$ 306.19
500$ 284.92

Description

General part information

M1A3PE1500 Series

ProASIC3

offers high performance in ultra low dendity FPGAs, a single-chip solution,

small footprint packages, reprogrammability, and an abundance of advanced

Documents

Technical documentation and resources

Product Change Notice EN

Datasheet