Zenode.ai Logo
Beta
DIP640-001BLF
Connectors, Interconnects

DIP640-001BLF

Obsolete
Amphenol ICC (FCI)

CONN IC DIP SOCKET 40POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

DIP640-001BLF
Connectors, Interconnects

DIP640-001BLF

Obsolete
Amphenol ICC (FCI)

CONN IC DIP SOCKET 40POS GOLD

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationDIP640-001BLF
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating0.76 Ám
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
FeaturesOpen Frame
Housing MaterialPolyester, Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)40
Pitch - Mating0.1 "
Pitch - Mating2.54 mm
Pitch - Post0.1 in
Pitch - Post2.54 mm
TerminationSolder
Termination Post Length0.125 in
Termination Post Length3.18 mm
TypeDIP
Type [custom]15.24 mm
Type [custom]0.6 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 0.00

Description

General part information

DIP640 Series

40 (2 x 20) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available