DIP640 Series
Manufacturer: Amphenol ICC (FCI)
Beta
⌘K
CONN IC DIP SOCKET 40POS GOLD
| Part | Housing Material | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Mounting Type | Type | Type | Type | Pitch - Post | Pitch - Post | Contact Finish - Mating | Contact Finish - Post | Contact Material - Mating | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Material Flammability Rating | Contact Material - Post [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 3.18 mm | 0.125 in | 0.1 in | 2.54 mm | Through Hole | DIP | 0.6 in | 15.24 mm | 2.54 mm | 0.1 in | Gold | Tin | Beryllium Copper | Solder | 30 Áin | 0.76 Ám | 200 µin | 5.08 µm | Open Frame | 40 | 20 | 2 | UL94 V-0 | Brass |
Amphenol ICC (FCI) | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 3.18 mm | 0.125 in | 0.1 in | 2.54 mm | Through Hole | DIP | 0.6 in | 15.24 mm | 2.54 mm | 0.1 in | Gold | Tin | Beryllium Copper | Solder | 10 çin | 0.25 çm | 200 µin | 5.08 µm | Open Frame | 40 | 20 | 2 | UL94 V-0 | Brass |