Specification	28-350002-11-RC

Board Material	FR4 Epoxy Glass
Board Thickness	1.57 mm
Board Thickness	0.062 "
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10 Áin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Post [custom]	Brass
Convert From (Adapter End)	SOIC
Convert To (Adapter End)	7.62 mm
Convert To (Adapter End)	DIP
Convert To (Adapter End)	0.3 in
Material	FR4 Epoxy Glass
Mounting Type	Through Hole
Number of Pins	28
Number of Positions	28
Package Accepted	SOIC
Pitch	0.05 in
Pitch	1.27 mm
Pitch - Mating	1.27 mm
Pitch - Mating	0.05 in
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Proto Board Type	DIP to DIP
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm

28-3500 Series

Part	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Convert From (Adapter End)	Mounting Type	Contact Finish - Post	Board Material	Contact Material - Post [custom]	Termination	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Pins	Number of Positions	Board Thickness	Board Thickness	Proto Board Type	Package Accepted	Material	Pitch	Pitch	Board Thickness	Size / Dimension [y]	Size / Dimension [y]	Size / Dimension [x]	Size / Dimension [x]
Aries Electronics 28-350002-11-RC	1.27 mm	0.05 in	0.1 in	2.54 mm	0.125 in	3.18 mm	SOIC	Through Hole	Gold	FR4 Epoxy Glass	Brass	Solder	7.62 mm	DIP	0.3 in	10 Áin	0.25 çm	28	28	1.57 mm	0.062 "	DIP to DIP	SOIC	FR4 Epoxy Glass	0.05 in	1.27 mm
Aries Electronics 28-350002-10																			28	1.57 mm	0.062 "	SMD to DIP	SOIC	FR4 Epoxy Glass	0.05 in	1.27 mm	0.0625 in	10.16 mm	0.4 "	71.12 mm	2.8 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly