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BSM120D12P2C005
Discrete Semiconductor Products

BSM080D12P2C008

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, DUAL N CHANNEL, 80 A, 1.2 KV, MODULE

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BSM120D12P2C005
Discrete Semiconductor Products

BSM080D12P2C008

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, DUAL N CHANNEL, 80 A, 1.2 KV, MODULE

Technical Specifications

Parameters and characteristics for this part

SpecificationBSM080D12P2C008
Configuration2 N-Channel (Dual)
Drain to Source Voltage (Vdss)1200 V
Drain to Source Voltage (Vdss)1.2 kV
Input Capacitance (Ciss) (Max) @ Vds [Max]800 pF
Mounting TypeChassis Mount
Operating Temperature175 °C
Package / CaseModule
Power - Max [Max]600 W
Supplier Device PackageModule
TechnologySilicon Carbide (SiC)
Vgs(th) (Max) @ Id4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 1$ 318.74
NewarkEach 1$ 331.49

Description

General part information

BSM080D12P2C008 Series

BSM080D12P2C008 is a half bridge module consisting of SiC-DMOS and SiC SBD.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

DC-AC IH Full-Bridge Inverter: Reference Circuit

Reference Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Create Symbols for PSpice Models

Models

How to measure the oscillation occurs between parallel-connected devices

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Taping Information

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Export Regulations

Export Information

Inner Structure

Package Information

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Evaluation Board User's Guide for C-type Full SiC Module (BSMGD3C12D24-EVK001)

User's Guide

What Is Thermal Design

Thermal Design

PFC Continuous Current Mode Diode-Bridge-Less Synchronous: Reference Circuit

Reference Design

Compliance of the ELV directive

Environmental Data

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

Optimized heat sink assembly method for effective heat dissipation

Thermal Design

Reliability Test Result

Manufacturing Data

How to Use PLECS Models

Technical Article

ESD Data

Characteristics Data

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

ROHM Solution Simulator Power Device User's Guide for Inverter

Simulations

DC-AC IH Half-Bridge Inverter: Reference Circuit

Reference Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

DC-DC Step-Up/Down Converter: Reference Circuit

Reference Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

ROHM Solution Simulator Power Device Use's Guide for PFC Circuits

Simulations

PFC Discontinuous Current Mode Diode-Bridge-Less Synchronous: Reference Circuit

Reference Design