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Microchip Technology-GRP-A-DATA-JANTX1N4471US Zener Diode Zener Single 18V 5% 1500mW 2-Pin A-MELF Bag
Discrete Semiconductor Products

JAN1N5614US

Active
Microchip Technology

200V STD RECTIFIER SQ SMT A-BODY SQ. MELF ROHS COMPLIANT: YES

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Microchip Technology-GRP-A-DATA-JANTX1N4471US Zener Diode Zener Single 18V 5% 1500mW 2-Pin A-MELF Bag
Discrete Semiconductor Products

JAN1N5614US

Active
Microchip Technology

200V STD RECTIFIER SQ SMT A-BODY SQ. MELF ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationJAN1N5614US
Current - Average Rectified (Io)1 A
Current - Reverse Leakage @ Vr500 nA
GradeMilitary
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]200 C
Operating Temperature - Junction [Min]-65 C
Reverse Recovery Time (trr)2 µs
SpeedStandard Recovery >500ns
Speed200 mA
Supplier Device PackageD-5A
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If1.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
ArrowN/A 1$ 7.86
10$ 7.77
25$ 7.67
100$ 7.13
250$ 7.02
1000$ 6.92
DigikeyBulk 100$ 7.37
Microchip DirectN/A 1$ 7.94
NewarkEach 100$ 7.37
500$ 7.09

Description

General part information

JANTX1N5614US-Rectifier Series

This "standard recovery" rectifier diode series is military qualified to MIL-PRF19500/427 and is ideal for high-reliability applications where a failure cannot be tolerated. These industry-recognized 1.0 Amp rated rectifiers for working peak reverse voltages from 200 to 1000 volts are hermetically sealed with voidlessglass construction using an internal "Category I" metallurgical bond. These devices are also available in surface mount MELF package configurations by adding a "US" suffix (see separate data sheet for 1N5614US thru 1N5622US). Microchip also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time speed requirements including fast and ultrafast device types in both through-hole and surface mount packages.

Documents

Technical documentation and resources