Connectors, Interconnects

6-1437529-6

Obsolete

CONN IC DIP SOCKET 6POS GOLD

Search across all available documentation for this part.

Connectors, Interconnects

Obsolete

CONN IC DIP SOCKET 6POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	6-1437529-6

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.51 µm
Contact Finish Thickness - Mating	20 µin
Contact Finish Thickness - Post	47.2 µin
Contact Finish Thickness - Post	1.2 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Copper Alloy
Contact Resistance	10 mOhm
Features	Closed Frame
Housing Material	Thermoplastic, Polyester
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	6
Number of Positions or Pins (Grid) [x]	2
Number of Positions or Pins (Grid) [y]	3 positions or pins
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Type	0.4 in
Type	DIP

Part	Contact Resistance	Material Flammability Rating	Contact Finish - Mating	Termination	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Type	Type	Mounting Type	Contact Material - Mating	Contact Material - Post [custom]	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Current Rating (Amps)	Type
TE Connectivity AMP Connectors 8-1437529-1	10 mOhm	UL94 V-0	Gold	Solder	0.1 "	2.54 mm	8	2	4	47.2 µin	1.2 µm	Closed Frame	Gold	-55 C	105 ░C	0.4 in	DIP	Through Hole	Beryllium Copper	Copper Alloy	Polyester Thermoplastic	0.51 µm	20 µin	0.1 in	2.54 mm
TE Connectivity AMP Connectors 6-1437529-6	10 mOhm	UL94 V-0	Gold	Solder	0.1 "	2.54 mm	6	2	3 positions or pins	47.2 µin	1.2 µm	Closed Frame	Gold	-55 C	105 ░C	0.4 in	DIP	Through Hole	Beryllium Copper	Copper Alloy	Polyester Thermoplastic	0.51 µm	20 µin	0.1 in	2.54 mm
TE Connectivity AMP Connectors 7-1437529-6	10 mOhm		Gold	Solder	0.1 "	2.54 mm	8	2	4			Closed Frame	Gold	-55 C	125 °C	0.3 in	DIP	Through Hole	Copper Alloy	Copper Alloy				0.1 in	2.54 mm	0.125 in	3.18 mm	3 A	7.62 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 2.44

General part information

6 (2 x 3) Pos DIP, 0.4" (10.16mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources

No documents available