
PIC16F15244-E/SS
Active8 BIT MCU, PIC16 FAMILY PIC16F152XX SERIES MICROCONTROLLERS, PIC16, 32 MHZ, 7 KB, 20 PINS, SSOP
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PIC16F15244-E/SS
Active8 BIT MCU, PIC16 FAMILY PIC16F152XX SERIES MICROCONTROLLERS, PIC16, 32 MHZ, 7 KB, 20 PINS, SSOP
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Technical Specifications
Parameters and characteristics for this part
| Specification | PIC16F15244-E/SS |
|---|---|
| Connectivity | I2C, LINbus, UART/USART, SPI |
| Core Processor | PIC |
| Core Size | 8-Bit |
| Data Converters | 2x10b |
| Data Converters | 12 |
| Mounting Type | Surface Mount |
| Number of I/O | 17 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 20-SSOP |
| Program Memory Size | 7 KB |
| Program Memory Type | FLASH |
| RAM Size | 512 |
| Speed | 32 MHz |
| Supplier Device Package | 20-SSOP |
| Voltage - Supply (Vcc/Vdd) [Max] | 5.5 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.8 V |
PIC16F15244 Series
Cost Effective 8-bit Microcontroller
| Part | Supplier Device Package | Package / Case | Package / Case | Package / Case | Mounting Type | Program Memory Type | Core Processor | Oscillator Type | Operating Temperature [Max] | Operating Temperature [Min] | Speed | Voltage - Supply (Vcc/Vdd) [Min] | Voltage - Supply (Vcc/Vdd) [Max] | Core Size | RAM Size | Number of I/O | Program Memory Size | Data Converters | Data Converters | Connectivity | Package / Case [y] | Package / Case [y] | Platform | Type | Utilized IC / Part | Contents | Suggested Programming Environment | Board Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 20-PDIP | 20-DIP | 7.62 mm | 0.3 in | Through Hole | FLASH | PIC | Internal | 85 °C | -40 °C | 32 MHz | 1.8 V | 5.5 V | 8-Bit | 512 | 17 | 7 KB | 2x10b | 12 | I2C LINbus SPI UART/USART | ||||||||
Microchip Technology | 20-PDIP | 20-DIP | 7.62 mm | 0.3 in | Through Hole | FLASH | PIC | Internal | 125 °C | -40 °C | 32 MHz | 1.8 V | 5.5 V | 8-Bit | 512 | 17 | 7 KB | 2x10b | 12 | I2C LINbus SPI UART/USART | ||||||||
Microchip Technology | 20-SSOP | 20-SSOP | Surface Mount | FLASH | PIC | Internal | 125 °C | -40 °C | 32 MHz | 1.8 V | 5.5 V | 8-Bit | 512 | 17 | 7 KB | 2x10b | 12 | I2C LINbus SPI UART/USART | ||||||||||
Microchip Technology | 20-VQFN (3x3) | 20-VFQFN Exposed Pad | Surface Mount | FLASH | PIC | Internal | 85 °C | -40 °C | 32 MHz | 1.8 V | 5.5 V | 8-Bit | 512 | 17 | 7 KB | 2x10b | 12 | I2C LINbus SPI UART/USART | ||||||||||
Microchip Technology | 20-SOIC | 20-SOIC | Surface Mount | FLASH | PIC | Internal | 125 °C | -40 °C | 32 MHz | 1.8 V | 5.5 V | 8-Bit | 512 | 17 | 7 KB | 2x10b | 12 | I2C LINbus SPI UART/USART | 0.295 in | 7.5 mm | ||||||||
Microchip Technology | 20-SSOP | 20-SSOP | Surface Mount | FLASH | PIC | Internal | 85 °C | -40 °C | 32 MHz | 1.8 V | 5.5 V | 8-Bit | 512 | 17 | 7 KB | 2x10b | 12 | I2C LINbus SPI UART/USART | ||||||||||
Microchip Technology | Fixed | PIC | Curiosity Nano | MCU 8-Bit | PIC16F15244 | Accessories Board(s) | MPLAB X | Evaluation Platform | ||||||||||||||||||||
Microchip Technology | 20-VQFN (3x3) | 20-VFQFN Exposed Pad | Surface Mount | FLASH | PIC | Internal | 125 °C | -40 °C | 32 MHz | 1.8 V | 5.5 V | 8-Bit | 512 | 17 | 7 KB | 2x10b | 12 | I2C LINbus SPI UART/USART |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 1 | $ 0.88 | |
| 25 | $ 0.81 | |||
| 100 | $ 0.73 | |||
| Microchip Direct | TUBE | 1 | $ 0.75 | |
| 25 | $ 0.69 | |||
| 100 | $ 0.63 | |||
| 1000 | $ 0.58 | |||
| 5000 | $ 0.55 | |||
| Newark | Each | 100 | $ 0.56 | |
Description
General part information
PIC16F15244 Series
[***Code Examples on GitHub***](https://github.com/orgs/microchip-pic-avr-examples/repositories?q=PIC16F152&type=all&language=&sort=)
The PIC16F152xx 8-bit product family features an essential peripheral set including key Core Independent Peripherals (CIPs), Intelligent Analog, and standard communication modules. Paired with it's ability for eXtreme Low-Power, this family is particularly well-suited for a wide range of low-power applications. Included in the feature set are multiple PWMs, various communication peripherals, an internal temperature sensor, and memory features like a Memory Access Partition (MAP) and Device Information Area (DIA). These product will be offered in a broad selection of packages and pin counts from 8 to 44(40)-pins, to support customers in a variety of applications.
Documents
Technical documentation and resources