LMZ30604RKGR
Active2.95V TO 6V, 4A STEP-DOWN POWER MODULE IN 9X11X2.8MM QFN PACKAGE
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LMZ30604RKGR
Active2.95V TO 6V, 4A STEP-DOWN POWER MODULE IN 9X11X2.8MM QFN PACKAGE
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Technical Specifications
Parameters and characteristics for this part
| Specification | LMZ30604RKGR |
|---|---|
| Applications | ITE (Commercial) |
| Control Features | Active High, Enable |
| Current - Output (Max) [Max] | 4 A |
| Efficiency | 95 % |
| Features | OTP, UVLO, OCP |
| Mounting Type | Surface Mount |
| Number of Outputs | 1 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 39-BQFN Exposed Pad |
| Size / Dimension [x] | 0.44 " |
| Size / Dimension [x] | 11.2 mm |
| Size / Dimension [y] | 0.36 " |
| Size / Dimension [y] | 9.2 mm |
| Size / Dimension [z] | 0.11 in |
| Size / Dimension [z] | 2.9 mm |
| Type | Non-Isolated PoL Module |
| Voltage - Input (Max) [Max] | 6 V |
| Voltage - Input (Min) [Min] | 2.95 V |
| Voltage - Output 1 [Max] | 3.6 V |
| Voltage - Output 1 [Min] | 0.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 4.58 | |
| 5 | $ 4.52 | |||
| 10 | $ 4.45 | |||
| 25 | $ 4.32 | |||
| 50 | $ 4.19 | |||
| 100 | $ 4.06 | |||
| 250 | $ 3.93 | |||
| Digi-Reel® | 1 | $ 4.58 | ||
| 5 | $ 4.52 | |||
| 10 | $ 4.45 | |||
| 25 | $ 4.32 | |||
| 50 | $ 4.19 | |||
| 100 | $ 4.06 | |||
| 250 | $ 3.93 | |||
| Tape & Reel (TR) | 500 | $ 3.67 | ||
| Texas Instruments | LARGE T&R | 1 | $ 4.05 | |
| 100 | $ 3.30 | |||
| 250 | $ 2.59 | |||
| 1000 | $ 2.20 | |||
Description
General part information
LMZ30604 Series
The LMZ30604 power module is an easy-to-use integrated power solution that combines a 4-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.
The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 4-A rated output current at 85°C ambient temperature without airflow.
The LMZ30604 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
Documents
Technical documentation and resources