LMZ30604 Series
2.95V to 6V, 4A Step-Down Power Module in 9x11x2.8mm QFN Package
Manufacturer: Texas Instruments
Catalog
2.95V to 6V, 4A Step-Down Power Module in 9x11x2.8mm QFN Package
Key Features
• Complete Integrated Power Solution AllowsSmall Footprint, Low-Profile Design9 mm × 11 mm × 2.8 mm package- Pin Compatible with LMZ30602 and LMZ30606Efficiencies Up To 96%Wide-Output Voltage Adjust0.8 V to 3.6 V, with ±1% Reference AccuracyAdjustable Switching Frequency(500 kHz to 2 MHz)Synchronizes to an External ClockAdjustable Slow-StartOutput Voltage Sequencing / TrackingPower Good OutputProgrammable Undervoltage Lockout (UVLO)Output Overcurrent ProtectionOver Temperature ProtectionOperating Temperature Range: –40°C to 85°CEnhanced Thermal Performance: 12°C/WMeets EN55022 Class B Emissions- Integrated Shielded InductorCreate a Custom Design Using the LMZ30604 With theWEBENCH®Power DesignerComplete Integrated Power Solution AllowsSmall Footprint, Low-Profile Design9 mm × 11 mm × 2.8 mm package- Pin Compatible with LMZ30602 and LMZ30606Efficiencies Up To 96%Wide-Output Voltage Adjust0.8 V to 3.6 V, with ±1% Reference AccuracyAdjustable Switching Frequency(500 kHz to 2 MHz)Synchronizes to an External ClockAdjustable Slow-StartOutput Voltage Sequencing / TrackingPower Good OutputProgrammable Undervoltage Lockout (UVLO)Output Overcurrent ProtectionOver Temperature ProtectionOperating Temperature Range: –40°C to 85°CEnhanced Thermal Performance: 12°C/WMeets EN55022 Class B Emissions- Integrated Shielded InductorCreate a Custom Design Using the LMZ30604 With theWEBENCH®Power Designer
Description
AI
The LMZ30604 power module is an easy-to-use integrated power solution that combines a 4-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.
The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 4-A rated output current at 85°C ambient temperature without airflow.
The LMZ30604 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
The LMZ30604 power module is an easy-to-use integrated power solution that combines a 4-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.
The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 4-A rated output current at 85°C ambient temperature without airflow.
The LMZ30604 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.