Zenode.ai Logo
Beta
TO-66 Package Style
Discrete Semiconductor Products

2N6213

Active
Microchip Technology

350V 5MA 3W POWER BJT TO-66 ROHS COMPLIANT: YES

Deep-Dive with AI

Search across all available documentation for this part.

TO-66 Package Style
Discrete Semiconductor Products

2N6213

Active
Microchip Technology

350V 5MA 3W POWER BJT TO-66 ROHS COMPLIANT: YES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification2N6213
Current - Collector (Ic) (Max) [Max]2 A
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]30 hFE
Mounting TypeThrough Hole
Operating Temperature [Max]200 °C
Operating Temperature [Min]-55 °C
Package / CaseTO-66-2, TO-213AA
Power - Max [Max]3 W
Supplier Device PackageTO-66 (TO-213AA)
Transistor TypePNP
Vce Saturation (Max) @ Ib, Ic [Max]2 V
Voltage - Collector Emitter Breakdown (Max) [Max]350 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 100$ 101.08
Microchip DirectN/A 1$ 108.85
NewarkEach 100$ 101.08
500$ 97.19

Description

General part information

2N6213-Transistor Series

This specification covers the performance requirements for PNP silicon, high-voltage, 2N6211, 2N6212, 2N6213 and 2N6213A transistors. Four levels of product assurance are provided for each encapsulated device (JAN, JANTX, JANTXV and JANS) as specified in MIL-PRF-19500/461. Two levels of product assurance are provided for each unencapsulated device (JANHC and JANKC). The device package outlines are as follows: TO-66 for all encapsulated device types. The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/461.

Documents

Technical documentation and resources