Integrated Circuits (ICs)
R9A07G075M05GFP#AA0
ActiveRenesas Electronics Corporation
IC MPU RZ 600/800MHZ 176LFQFP
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Integrated Circuits (ICs)
R9A07G075M05GFP#AA0
ActiveRenesas Electronics Corporation
IC MPU RZ 600/800MHZ 176LFQFP
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | R9A07G075M05GFP#AA0 |
|---|---|
| Additional Interfaces | CANbus, I2C, SPI, WDT, SCI |
| Co-Processors/DSP | Multimedia, NEON™ SIMD |
| Core Processor | ARM® Cortex®-R52 |
| Ethernet | 10 Mbps, 100 Mbps, 1000 Mbps |
| Graphics Acceleration | False |
| Mounting Type | Surface Mount |
| Number of Cores/Bus Width | 1, 32 Bit |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 C |
| Package / Case | 176-LQFP Exposed Pad |
| Security Features | TRNG, Crypto Accelerator, JTAG, Boot Security |
| Speed | 600 MHz, 800 MHz |
| Supplier Device Package | 176-LFQFP (24x24) |
| USB | USB 2.0 (1) |
| Voltage - I/O | 1.8 V, 3.3 V |
| Part | Supplier Device Package | Operating Temperature [Min] | Operating Temperature [Max] | Co-Processors/DSP | Voltage - I/O | Core Processor | Speed | Mounting Type | Additional Interfaces | Ethernet | Graphics Acceleration | Number of Cores/Bus Width | USB | Security Features | Supplier Device Package [custom] | Package / Case | Ethernet | Display & Interface Controllers | Number of Cores/Bus Width [custom] | Number of Cores/Bus Width [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Renesas Electronics Corporation | 320-FBGA (17x17) 320-LFBGA (17x17) | -40 C | 125 °C | Multimedia NEON™ SIMD | 1.8 V 3.3 V | ARM® Cortex®-R52 | 600 MHz 800 MHz | Surface Mount | CANbus I2C SCI SPI WDT | 10 Mbps 100 Mbps 1000 Mbps | 2 32 Bit | USB 2.0 (1) | ||||||||
 Renesas Electronics Corporation | 361-BGA | -40 ¯C | 85 C | AndesCore™ AX45MP | 1 GHz | Surface Mount | CANbus eMMC/SD/SDIO I2C SPI UART | 1 16 Bit | USB 2.0 (2) | AES ECC GHASH RSA SHA-1 SHA-224 SHA-256 TRNG | 13x13 | 361-LFBGA | GbE (2) | |||||||
 Renesas Electronics Corporation | 361-PBGA (13x13) | -40 ¯C | 85 C | 1.1 V 1.8 V 3.3 V | ARM® Cortex®-A55 | 1 GHz | Surface Mount | CANbus eMMC/SD/SDIO I2C SCI SPI UART | 10 Mbps 100 Mbps 1000 Mbps | 1 64 Bit | USB 2.0 (2) | 361-BGA | LCD MIPI/CSI2 | |||||||
 Renesas Electronics Corporation | 225-LFBGA (13x13) | -40 C | 125 °C | Multimedia NEON™ SIMD | 1.8 V 3.3 V | ARM® Cortex®-R52 | 600 MHz 800 MHz | Surface Mount | CANbus I2C SCI SPI WDT | 10 Mbps 100 Mbps 1000 Mbps | 2 32 Bit | USB 2.0 (1) | 225-LFBGA | |||||||
 Renesas Electronics Corporation | 551-LFBGA (21x21) | -40 ¯C | 85 C | ARM® Mali-G31 | 1.8 V 3.3 V | ARM® Cortex®-A55 ARM® Cortex®-M33 | 1.2 GHz 200 MHz | Surface Mount | CANbus eMMC/SD/SDIO I2C SPI UART | 10 Mbps 100 Mbps 1000 Mbps | USB 2.0 (2) | 551-LFBGA | MIPI-CSI MIPI-DSI | 3 | 64 Bit | |||||
 Renesas Electronics Corporation | 266-BGA (11x11) | -40 ¯C | 85 C | AndesCore™ AX45MP | 1 GHz | Surface Mount | CANbus eMMC/SD/SDIO I2C SPI UART | 1 16 Bit | USB 2.0 (2) | AES ECC GHASH RSA SHA-1 SHA-224 SHA-256 TRNG | 266-BGA | GbE (1) | ||||||||
Renesas Electronics Corporation | 176-LFQFP (24x24) | -40 C | 125 °C | Multimedia NEON™ SIMD | 1.8 V 3.3 V | ARM® Cortex®-R52 | 600 MHz 800 MHz | Surface Mount | CANbus I2C SCI SPI WDT | 10 Mbps 100 Mbps 1000 Mbps | 1 32 Bit | USB 2.0 (1) | Boot Security Crypto Accelerator JTAG TRNG | 176-LQFP Exposed Pad | ||||||
Renesas Electronics Corporation | 225-LFBGA (13x13) | -40 C | 125 °C | Multimedia NEON™ SIMD | 1.8 V 3.3 V | ARM® Cortex®-R52 | 600 MHz 800 MHz | Surface Mount | CANbus I2C SCI SPI WDT | 10 Mbps 100 Mbps 1000 Mbps | 2 32 Bit | USB 2.0 (1) | Boot Security Crypto Accelerator JTAG TRNG | 225-LFBGA | ||||||
Renesas Electronics Corporation | 225-LFBGA (13x13) | -40 C | 125 °C | Multimedia NEON™ SIMD | 1.8 V 3.3 V | ARM® Cortex®-R52 | 600 MHz 800 MHz | Surface Mount | CANbus I2C SCI SPI WDT | 10 Mbps 100 Mbps 1000 Mbps | 2 32 Bit | USB 2.0 (1) | Boot Security Crypto Accelerator JTAG TRNG | 225-LFBGA | ||||||
 Renesas Electronics Corporation | 456-LFBGA (15x15) | -40 ¯C | 85 C | ARM® Mali-G31 ARMÛ Mali-G31 Multimedia NEON™ SIMD | 1.8 V 3.3 V | ARM® Cortex®-A55 ARM® Cortex®-M33 ARMÛ CortexÛ-A55 ARMÛ CortexÛ-M33 | 1.2 GHz 200 MHz | Surface Mount | CANbus eMMC/SD/SDIO I2C SPI UART | 10 Mbps 100 Mbps 1000 Mbps | USB 2.0 (2) | 456-LFBGA | LCD MIPI/CSI MIPI/DSI | 3 | 64 Bit |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 39 | $ 23.00 | |
| Tray | 1 | $ 21.44 | ||
| 10 | $ 19.78 | |||
| 40 | $ 18.89 | |||
| 80 | $ 16.89 | |||
| 240 | $ 16.11 | |||
| 440 | $ 15.33 | |||
Description
General part information
R9A07 Series
ARM® Cortex®-R52 Microprocessor IC RZ/T2M 1 Core, 32-Bit 600MHz, 800MHz 176-LFQFP (24x24)
Documents
Technical documentation and resources