Integrated Circuits (ICs)

CYT3DLABHBQ1AESGS

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ARM MICROCONTROLLERS - MCU TRAVEO-2 CLUST.2.5DGRAPH

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DocumentsTechnical Data Sheet EN Datasheet

Integrated Circuits (ICs)

CYT3DLABHBQ1AESGS

Active

INFINEON

ARM MICROCONTROLLERS - MCU TRAVEO-2 CLUST.2.5DGRAPH

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DocumentsTechnical Data Sheet EN Datasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	CYT3DLABHBQ1AESGS

Connectivity	LVD, WDT, I2S, DMA, Temp Sensor
Core Processor	ARM® Cortex®-M7F, ARM® Cortex®-M0+
Core Size	32 Bit
Core Size	Dual-Core
EEPROM Size	128 K
Mounting Type	Surface Mount
Number of I/O	108
Operating Temperature [Max]	105 °C
Operating Temperature [Min]	-40 °C
Package / Case	216-QFP, 216-LQFP Exposed Pad
Peripherals	LVD, I2S, DMA, WDT, Temp Sensor
Program Memory Size	4.063 MB
Program Memory Type	FLASH
RAM Size	384 K
Speed	240 MHz
Supplier Device Package	216-TQFP, 216-TEQFP (24x24)
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	2.7 V

CYT3DLA Series

Part	EEPROM Size	Program Memory Size	Program Memory Type	Oscillator Type	Peripherals	Connectivity	Core Processor	Number of I/O	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Core Size	Core Size	Package / Case	RAM Size	Data Converters	Supplier Device Package	Speed	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type
INFINEON CYT3DLABEBQ1AESGST	128 K	4.06 MB	FLASH	External Internal	DMA I2S LVD Temp Sensor WDT	CANbus Ethernet I2C LINbus SPI UART/USART	ARM® Cortex®-M0+ ARM® Cortex®-M7F	108	5.5 V	2.7 V	32 Bit	Dual-Core	216-LQFP Exposed Pad	384 K	A/D 48x12b SAR	216-TEQFP (24x24)	100 MHz 240 MHz	-40 °C	105 °C	Surface Mount
INFINEON CYT3DLABEBQ1AESGS	128 K	4.06 MB	FLASH	External Internal	DMA I2S LVD Temp Sensor WDT	CANbus Ethernet I2C LINbus SPI UART/USART	ARM® Cortex®-M0+ ARM® Cortex®-M7F	108	5.5 V	2.7 V	32 Bit	Dual-Core	216-LQFP Exposed Pad	384 K	A/D 48x12b SAR	216-TEQFP (24x24)	100 MHz 240 MHz	-40 °C	105 °C	Surface Mount
INFINEON CYT3DLABFBQ1AESGS	128 K	4.06 MB	FLASH	External Internal	DMA I2S LVD Temp Sensor WDT	CANbus Ethernet I2C LINbus SPI UART/USART	ARM® Cortex®-M0+ ARM® Cortex®-M7F	108	5.5 V	2.7 V	32 Bit	Dual-Core	216-LQFP Exposed Pad	384 K	A/D 48x12b SAR	216-TEQFP (24x24)	100 MHz 240 MHz	-40 °C	105 °C	Surface Mount
INFINEON CYT3DLABABQ1AESGST	128 K	4.063 MB	FLASH		DMA I2S LVD Temp Sensor WDT	DMA I2S LVD Temp Sensor WDT	ARM® Cortex®-M0+ ARM® Cortex®-M7F	108	5.5 V	2.7 V	32 Bit	Dual-Core	216-LQFP Exposed Pad 216-QFP	384 K		216-TEQFP (24x24) 216-TQFP	240 MHz	-40 °C	105 °C	Surface Mount
INFINEON CYT3DLABHBQ1AESGS	128 K	4.063 MB	FLASH		DMA I2S LVD Temp Sensor WDT	DMA I2S LVD Temp Sensor WDT	ARM® Cortex®-M0+ ARM® Cortex®-M7F	108	5.5 V	2.7 V	32 Bit	Dual-Core	216-LQFP Exposed Pad 216-QFP	384 K		216-TEQFP (24x24) 216-TQFP	240 MHz	-40 °C	105 °C	Surface Mount
INFINEON CYT3DLABGBQ1AESGS	128 K	4.063 MB	FLASH		DMA I2S LVD Temp Sensor WDT	DMA I2S LVD Temp Sensor WDT	ARM® Cortex®-M0+ ARM® Cortex®-M7F	108	5.5 V	2.7 V	32 Bit	Dual-Core	216-LQFP Exposed Pad 216-QFP	384 K		216-TEQFP (24x24) 216-TQFP	240 MHz	-40 °C	105 °C	Surface Mount
INFINEON CYT3DLABGBQ1AESGST	128 K	4.063 MB	FLASH		DMA I2S LVD Temp Sensor WDT	DMA I2S LVD Temp Sensor WDT	ARM® Cortex®-M0+ ARM® Cortex®-M7F	108	5.5 V	2.7 V	32 Bit	Dual-Core	216-LQFP Exposed Pad 216-QFP	384 K		216-TEQFP (24x24) 216-TQFP	240 MHz	-40 °C	105 °C	Surface Mount

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	400	$ 31.36
	Tray	1	$ 36.06
		10	$ 33.26
		40	$ 31.77
		80	$ 28.40
		240	$ 27.09
Mouser	N/A	1	$ 37.84
		10	$ 30.78
		25	$ 28.28
		100	$ 26.88
		250	$ 26.07
		400	$ 24.37
Newark	Each	1	$ 34.89
		5	$ 32.04
		10	$ 29.19
		25	$ 27.25

Description

General part information

CYT3DLA Series

CYT3DLABHBQ1AESGSbelongs to the TRAVEO™ T2GCYT3DL familyof microcontrollers. It is based on the highly-efficient embedded processor Arm Cortex-M7 and combines a 2.5D Graphics engine, sound processing, and an Arm® Cortex®-M0+ CPU for peripheral and security processing. Moreover, it includes a WVGA GFX and a 216-pin TEQFP package. It is dedicated to automotive systems such as instrument clusters and Head-Up Displays (HUD).

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet