Connectors, Interconnects

8468-11B1-RK-TP

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3M Electronic Specialty

IC & COMPONENT SOCKET, 68 CONTACTS, PLCC SOCKET, 2.54 MM, 8400 SERIES, COPPER ALLOY

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DocumentsTechnical Data Sheet EN

Connectors, Interconnects

8468-11B1-RK-TP

Active

3M Electronic Specialty

IC & COMPONENT SOCKET, 68 CONTACTS, PLCC SOCKET, 2.54 MM, 8400 SERIES, COPPER ALLOY

Deep-Dive with AI

DocumentsTechnical Data Sheet EN

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	8468-11B1-RK-TP

Contact Finish - Post	Tin
Contact Finish Thickness - Post	4.06 µm
Contact Finish Thickness - Post	160 µin
Contact Material - Mating	Copper Alloy
Contact Material - Post [custom]	Copper Alloy
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	4
Number of Positions or Pins (Grid) [custom]	17
Number of Positions or Pins (Grid) [custom]	68
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-40 C
Pitch - Mating	1.27 mm
Pitch - Mating	0.05 in
Pitch - Post	0.05 in
Pitch - Post	1.27 mm
Termination	Solder
Termination Post Length	0.132 "
Termination Post Length	3.35 mm
Type	PLCC

8468 Series

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Termination	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Contact Material - Mating	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Features	Pitch - Mating	Pitch - Mating	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Type	Contact Finish - Post	Contact Resistance
3M Electronic Specialty 8468-11B1-RK-TP	1 A	0.132 "	3.35 mm	UL94 V-0	Solder	4	17	68	4.06 µm	160 µin	Polybutylene Terephthalate (PBT) Glass Filled	Copper Alloy	Copper Alloy	0.05 in	1.27 mm	Closed Frame	1.27 mm	0.05 in	Through Hole	-40 C	105 ░C	PLCC	Tin
3M Electronic Specialty 8468-21A1-RK-TP	1 A	0.132 "	3.35 mm	UL94 V-0	Solder	4	17	68	4.06 µm	160 µin	Polybutylene Terephthalate (PBT) Glass Filled	Copper Alloy	Copper Alloy	0.05 in	1.27 mm	Closed Frame	1.27 mm	0.05 in	Surface Mount	-40 C	105 ░C	PLCC	Tin
3M Electronic Specialty 8468-21B1-RK-TP	1 A	0.132 "	3.35 mm	UL94 V-0	Solder	4	17	68	4.06 µm	160 µin	Polybutylene Terephthalate (PBT) Glass Filled	Copper Alloy	Copper Alloy	0.05 in	1.27 mm	Closed Frame	1.27 mm	0.05 in	Surface Mount	-40 C	105 ░C	PLCC	Tin
3M Electronic Specialty 8468-21B1-RK-TR	1 A	0.132 "	3.35 mm	UL94 V-0	Solder	4	17	68	4.06 µm	160 µin	Polybutylene Terephthalate (PBT) Glass Filled	Copper Alloy	Copper Alloy	0.05 in	1.27 mm	Closed Frame	1.27 mm	0.05 in	Surface Mount	-40 C	105 ░C	PLCC	Tin	15 mOhm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	1010	$ 2.79
	Tube	1	$ 2.94
		19	$ 2.67
		38	$ 2.52
		57	$ 2.47
		114	$ 2.35
		266	$ 2.05
		513	$ 2.00
		1007	$ 1.70
		2508	$ 1.59
Newark	Each	1	$ 3.43
		10	$ 3.13
		100	$ 2.68
		500	$ 2.24
		1000	$ 1.92
		5000	$ 1.70
		10000	$ 1.66

Description

General part information

8468 Series

Industry standard socket for JEDEC A/B PLCCs, incorporating internal standoffs for precision chip positioning, bottom standoffs for simpler flux residue removal and 2.54mm grid solder tails. UL recognised.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet