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Discrete Semiconductor Products

JANKCB2N5002

Active
Microchip Technology

RH POWER BJT DIE ROHS COMPLIANT: YES

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Search across all available documentation for this part.

Discrete Semiconductor Products

JANKCB2N5002

Active
Microchip Technology

RH POWER BJT DIE ROHS COMPLIANT: YES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationJANKCB2N5002
Current - Collector Cutoff (Max) [Max]50 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]30
GradeMilitary
Mounting TypeStud Mount
Package / CaseDie
Power - Max [Max]2 W
QualificationMIL-PRF-19500/534
Supplier Device PackageDie
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic [Max]1.5 V
Voltage - Collector Emitter Breakdown (Max) [Max]80 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 100$ 345.64
Microchip DirectN/A 1$ 372.23
NewarkEach 100$ 345.64
500$ 332.34

Description

General part information

JANKCB2N5002-Transistor-Die Series

This specification covers the performance requirements for NPN, silicon, power, 2N5002 and 2N5004 transistors for use in high-speed power-switching applications. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/534. Two levels of product assurance (JANHC and JANKC) for each unencapsulated device type die.

Documents

Technical documentation and resources