16-3500 Series

Part	Pitch	Pitch	Board Thickness	Board Thickness	Board Thickness	Number of Positions	Material	Proto Board Type	Package Accepted	Size / Dimension [custom]	Size / Dimension	Size / Dimension [custom]	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Mounting Type	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Board Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length	Termination	Contact Finish - Post	Convert From (Adapter End)	Number of Pins	Contact Material - Post [custom]
Aries Electronics 16-350000-10	0.05 in	1.27 mm	1.57 mm	0.062 "	0.0625 in	16	FR4 Epoxy Glass	SMD to DIP	SOIC	11.43 mm	11.43 mm 40.64 mm	40.64 mm
Aries Electronics 16-350000-10-HT	0.05 in	1.27 mm	1.57 mm	0.062 "		16	FR4 Epoxy Glass	DIP to DIP	SOIC				7.62 mm	DIP	0.3 in	Through Hole	1.27 mm	0.05 in	0.1 in	2.54 mm	Polyimide (PI)	200 µin	5.08 µm	0.125 in	3.18 mm	Solder	Tin-Lead	SOIC	16	Brass

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly