Connectors, Interconnects

XR2C-1511-N

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Omron Electronics Inc-EMC Div

CONN SOCKET SIP 15POS GOLD

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Connectors, Interconnects

XR2C-1511-N

Active

Omron Electronics Inc-EMC Div

CONN SOCKET SIP 15POS GOLD

Deep-Dive with AI

DocumentsHow to Read Date Codes Datasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	XR2C-1511-N

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 Áin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	20 mOhm
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	15
Number of Positions or Pins (Grid) [x]	1
Number of Positions or Pins (Grid) [y]	15
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length [x]	3.2 mm
Termination Post Length [x]	0.126 in
Type	SIP

XR2C Series

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post [custom]	Current Rating (Amps)	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Housing Material	Contact Resistance	Contact Finish - Mating	Mounting Type	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [y]	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Post	Pitch - Post	Contact Finish - Post	Termination	Contact Material - Post	Features	Number of Positions or Pins (Grid) [custom]	Termination Post Length [x]	Termination Post Length [x]	Number of Positions or Pins (Grid)
Omron Electronics Inc-EMC Div XR2C1011N	10 Áin	0.25 çm	SIP	UL94 V-0	3.5 mm	0.138 in	0.25 µm	10 µin	Brass	1 A	Beryllium Copper	0.1 "	2.54 mm	Polybutylene Terephthalate (PBT) Glass Filled	20 mOhm	Gold	Threaded	1	10	10	-55 C	125 °C	0.1 in	2.54 mm	Gold	Solder
Omron Electronics Inc-EMC Div XR2C-3205	30 µin	0.76 µm	SIP	UL94 V-0			0.76 Ám	30 Áin		1 A	Beryllium Copper	0.1 "	2.54 mm	Polybutylene Terephthalate (PBT) Glass Filled	20 mOhm	Gold	Through Hole		32		-55 C	125 °C	0.1 in	2.54 mm	Gold	Solder	Beryllium Copper	Closed Frame	1 x 32
Omron Electronics Inc-EMC Div XR2C-0311-N	10 Áin	0.25 çm	SIP	UL94 V-0			0.25 µm	10 µin		1 A	Beryllium Copper	0.1 "	2.54 mm	Polybutylene Terephthalate (PBT) Glass Filled	20 mOhm	Gold	Through Hole				-55 C	125 °C	0.1 in	2.54 mm	Gold	Solder	Beryllium Copper	Closed Frame		3.2 mm	0.126 in	3 (1 x 3)
Omron Electronics Inc-EMC Div XR2C-1511-N	10 Áin	0.25 çm	SIP	UL94 V-0			0.25 µm	10 µin		1 A	Beryllium Copper	0.1 "	2.54 mm	Polybutylene Terephthalate (PBT) Glass Filled	20 mOhm	Gold	Through Hole	1	15	15	-55 C	125 °C	0.1 in	2.54 mm	Gold	Solder	Beryllium Copper	Closed Frame		3.2 mm	0.126 in
Omron Electronics Inc-EMC Div XR2C-3215	10 Áin	0.25 çm	SIP	UL94 V-0			0.25 µm	10 µin	Brass	1 A	Beryllium Copper	0.1 "	2.54 mm	Polybutylene Terephthalate (PBT) Glass Filled	20 mOhm	Gold	Threaded		32		-55 C	125 °C	0.1 in	2.54 mm	Gold	Solder			1 x 32

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.00