XR2C Series

Manufacturer: Omron Electronics Inc-EMC Div

Catalog

CONN SOCKET SIP 10POS GOLD

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post [custom]	Current Rating (Amps)	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Housing Material	Contact Resistance	Contact Finish - Mating	Mounting Type	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [y]	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Post	Pitch - Post	Contact Finish - Post	Termination	Contact Material - Post	Features	Number of Positions or Pins (Grid) [custom]	Termination Post Length [x]	Termination Post Length [x]	Number of Positions or Pins (Grid)
Omron Electronics Inc-EMC Div XR2C1011N	10 Áin	0.25 çm	SIP	UL94 V-0	3.5 mm	0.138 in	0.25 µm	10 µin	Brass	1 A	Beryllium Copper	0.1 "	2.54 mm	Polybutylene Terephthalate (PBT) Glass Filled	20 mOhm	Gold	Threaded	1	10	10	-55 C	125 °C	0.1 in	2.54 mm	Gold	Solder
Omron Electronics Inc-EMC Div XR2C-3205	30 µin	0.76 µm	SIP	UL94 V-0			0.76 Ám	30 Áin		1 A	Beryllium Copper	0.1 "	2.54 mm	Polybutylene Terephthalate (PBT) Glass Filled	20 mOhm	Gold	Through Hole		32		-55 C	125 °C	0.1 in	2.54 mm	Gold	Solder	Beryllium Copper	Closed Frame	1 x 32
Omron Electronics Inc-EMC Div XR2C-0311-N	10 Áin	0.25 çm	SIP	UL94 V-0			0.25 µm	10 µin		1 A	Beryllium Copper	0.1 "	2.54 mm	Polybutylene Terephthalate (PBT) Glass Filled	20 mOhm	Gold	Through Hole				-55 C	125 °C	0.1 in	2.54 mm	Gold	Solder	Beryllium Copper	Closed Frame		3.2 mm	0.126 in	3 (1 x 3)
Omron Electronics Inc-EMC Div XR2C-1511-N	10 Áin	0.25 çm	SIP	UL94 V-0			0.25 µm	10 µin		1 A	Beryllium Copper	0.1 "	2.54 mm	Polybutylene Terephthalate (PBT) Glass Filled	20 mOhm	Gold	Through Hole	1	15	15	-55 C	125 °C	0.1 in	2.54 mm	Gold	Solder	Beryllium Copper	Closed Frame		3.2 mm	0.126 in
Omron Electronics Inc-EMC Div XR2C-3215	10 Áin	0.25 çm	SIP	UL94 V-0			0.25 µm	10 µin	Brass	1 A	Beryllium Copper	0.1 "	2.54 mm	Polybutylene Terephthalate (PBT) Glass Filled	20 mOhm	Gold	Threaded		32		-55 C	125 °C	0.1 in	2.54 mm	Gold	Solder			1 x 32