ISOTMP35BEDFQRQ1
ActiveAUTOMOTIVE 1.5°C BASIC ISOLATED TEMPERATURE SENSOR WITH 10MV/°C ANALOG OUTPUT
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ISOTMP35BEDFQRQ1
ActiveAUTOMOTIVE 1.5°C BASIC ISOLATED TEMPERATURE SENSOR WITH 10MV/°C ANALOG OUTPUT
Technical Specifications
Parameters and characteristics for this part
| Specification | ISOTMP35BEDFQRQ1 |
|---|---|
| Accuracy - Highest (Lowest) [Max] | 1.5 °C |
| Accuracy - Highest (Lowest) [Min] | 2.5 °C |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Output Type | Analog Voltage |
| Qualification | AEC-Q100 |
| Resolution | 16 b |
| Sensing Temperature - Local [Max] | 150 °C |
| Sensing Temperature - Local [Min] | -40 °C |
| Sensor Type | Analog |
| Test Condition | -40°C ~ 150°C |
| Test Condition [Max] | 70 °C |
| Test Condition [Min] | 0 °C |
| Voltage - Supply [Max] | 5.5 V |
| Voltage - Supply [Min] | 2.3 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tape & Reel (TR) | 3000 | $ 1.66 | |
| 6000 | $ 1.60 | |||
| Texas Instruments | LARGE T&R | 1 | $ 2.50 | |
| 100 | $ 2.19 | |||
| 250 | $ 1.53 | |||
| 1000 | $ 1.24 | |||
Description
General part information
ISOTMP35-Q1 Series
The ISOTMP35-Q1 is the industry’s first isolated temperature sensor IC, combining an integrated isolation barrier, up to 3000VRMS withstand voltage, with an analog temperature sensor featuring a 10mV/°C slope from –40°C to 150°C. This integration enables the sensor to be co-located with high voltage heat sources (for example: HV FETs, IGBTs, or HV contactors) without requiring expensive isolation circuitry. The direct contact with the high-voltage heat source also provides greater accuracy and faster thermal response compared with approaches where the sensor is placed further away to meet isolation requirements.
Operating from a non-isolated 2.3V to 5.5V supply, the ISOTMP35-Q1 allows easy integration into applications where sub-regulated power is not available on the high-voltage plane.
The integrated isolation barrier satisfies UL 1577 requirements. The surface mount package (7-pin SOIC) provides excellent heat flow from the heat source to the embedded thermal sensor, minimizing thermal mass and providing more accurate heat-source measurement. This reduces the need for time-consuming thermal modeling and improves system design margin by reducing mechanical variations due to manufacturing and assembly.
Documents
Technical documentation and resources