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Sensors, Transducers

ISOTMP35BEDFQRQ1

Active
Texas Instruments

AUTOMOTIVE 1.5°C BASIC ISOLATED TEMPERATURE SENSOR WITH 10MV/°C ANALOG OUTPUT

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Sensors, Transducers

ISOTMP35BEDFQRQ1

Active
Texas Instruments

AUTOMOTIVE 1.5°C BASIC ISOLATED TEMPERATURE SENSOR WITH 10MV/°C ANALOG OUTPUT

Technical Specifications

Parameters and characteristics for this part

SpecificationISOTMP35BEDFQRQ1
Accuracy - Highest (Lowest) [Max]1.5 °C
Accuracy - Highest (Lowest) [Min]2.5 °C
GradeAutomotive
Mounting TypeSurface Mount
Output TypeAnalog Voltage
QualificationAEC-Q100
Resolution16 b
Sensing Temperature - Local [Max]150 °C
Sensing Temperature - Local [Min]-40 °C
Sensor TypeAnalog
Test Condition-40°C ~ 150°C
Test Condition [Max]70 °C
Test Condition [Min]0 °C
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]2.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 3000$ 1.66
6000$ 1.60
Texas InstrumentsLARGE T&R 1$ 2.50
100$ 2.19
250$ 1.53
1000$ 1.24

Description

General part information

ISOTMP35-Q1 Series

The ISOTMP35-Q1 is the industry’s first isolated temperature sensor IC, combining an integrated isolation barrier, up to 3000VRMS withstand voltage, with an analog temperature sensor featuring a 10mV/°C slope from –40°C to 150°C. This integration enables the sensor to be co-located with high voltage heat sources (for example: HV FETs, IGBTs, or HV contactors) without requiring expensive isolation circuitry. The direct contact with the high-voltage heat source also provides greater accuracy and faster thermal response compared with approaches where the sensor is placed further away to meet isolation requirements.

Operating from a non-isolated 2.3V to 5.5V supply, the ISOTMP35-Q1 allows easy integration into applications where sub-regulated power is not available on the high-voltage plane.

The integrated isolation barrier satisfies UL 1577 requirements. The surface mount package (7-pin SOIC) provides excellent heat flow from the heat source to the embedded thermal sensor, minimizing thermal mass and providing more accurate heat-source measurement. This reduces the need for time-consuming thermal modeling and improves system design margin by reducing mechanical variations due to manufacturing and assembly.