ISOTMP35-Q1 Series
Automotive 1.5°C basic isolated temperature sensor with 10mV/°C analog output
Manufacturer: Texas Instruments
Catalog
Automotive 1.5°C basic isolated temperature sensor with 10mV/°C analog output
Key Features
• AEC-Q100 qualified with:Temperature grade 0: –40°C to 150°C Ambient Operating Temperature RangeDevice HBM ESD classification level 2Device CDM ESD classification level C5Functional Safety-Capable– Documentation available to aid functional safety system designRobust integrated isolation barrier:Withstand isolation voltage: 3000VRMSIsolation working voltage: 500VRMSIsolation barrier life: > 50 yearsTemperature sensor accuracy±0.5°C typical at 25°C±1.5°C maximum from 0°C to 70°C±2.0°C maximum from –40°C to 150°COperating supply range: 2.3V to 5.5VPositive slope sensor gain: 10mV/°C, with 500mV offset at 0°CFast thermal response: < 2 secondsShort circuit protected outputLow power consumption: 9µA (typical)DFQ (SOIC-7) packageSafety-related certifications (planned):3kVRMS isolation for 1 minute per UL 1577AEC-Q100 qualified with:Temperature grade 0: –40°C to 150°C Ambient Operating Temperature RangeDevice HBM ESD classification level 2Device CDM ESD classification level C5Functional Safety-Capable– Documentation available to aid functional safety system designRobust integrated isolation barrier:Withstand isolation voltage: 3000VRMSIsolation working voltage: 500VRMSIsolation barrier life: > 50 yearsTemperature sensor accuracy±0.5°C typical at 25°C±1.5°C maximum from 0°C to 70°C±2.0°C maximum from –40°C to 150°COperating supply range: 2.3V to 5.5VPositive slope sensor gain: 10mV/°C, with 500mV offset at 0°CFast thermal response: < 2 secondsShort circuit protected outputLow power consumption: 9µA (typical)DFQ (SOIC-7) packageSafety-related certifications (planned):3kVRMS isolation for 1 minute per UL 1577
Description
AI
The ISOTMP35-Q1 is the industry’s first isolated temperature sensor IC, combining an integrated isolation barrier, up to 3000VRMS withstand voltage, with an analog temperature sensor featuring a 10mV/°C slope from –40°C to 150°C. This integration enables the sensor to be co-located with high voltage heat sources (for example: HV FETs, IGBTs, or HV contactors) without requiring expensive isolation circuitry. The direct contact with the high-voltage heat source also provides greater accuracy and faster thermal response compared with approaches where the sensor is placed further away to meet isolation requirements.
Operating from a non-isolated 2.3V to 5.5V supply, the ISOTMP35-Q1 allows easy integration into applications where sub-regulated power is not available on the high-voltage plane.
The integrated isolation barrier satisfies UL 1577 requirements. The surface mount package (7-pin SOIC) provides excellent heat flow from the heat source to the embedded thermal sensor, minimizing thermal mass and providing more accurate heat-source measurement. This reduces the need for time-consuming thermal modeling and improves system design margin by reducing mechanical variations due to manufacturing and assembly.
The ISOTMP35-Q1 class-AB output driver provides a strong 500µA maximum output to drive capacitive loads up to 1000pF and is designed to directly interface with analog-to-digital converter (ADC) sample and hold inputs.
The ISOTMP35-Q1 is the industry’s first isolated temperature sensor IC, combining an integrated isolation barrier, up to 3000VRMS withstand voltage, with an analog temperature sensor featuring a 10mV/°C slope from –40°C to 150°C. This integration enables the sensor to be co-located with high voltage heat sources (for example: HV FETs, IGBTs, or HV contactors) without requiring expensive isolation circuitry. The direct contact with the high-voltage heat source also provides greater accuracy and faster thermal response compared with approaches where the sensor is placed further away to meet isolation requirements.
Operating from a non-isolated 2.3V to 5.5V supply, the ISOTMP35-Q1 allows easy integration into applications where sub-regulated power is not available on the high-voltage plane.
The integrated isolation barrier satisfies UL 1577 requirements. The surface mount package (7-pin SOIC) provides excellent heat flow from the heat source to the embedded thermal sensor, minimizing thermal mass and providing more accurate heat-source measurement. This reduces the need for time-consuming thermal modeling and improves system design margin by reducing mechanical variations due to manufacturing and assembly.
The ISOTMP35-Q1 class-AB output driver provides a strong 500µA maximum output to drive capacitive loads up to 1000pF and is designed to directly interface with analog-to-digital converter (ADC) sample and hold inputs.