Specification	R523W447050P0K

Applications	Automotive
Capacitance	4.7 µF
Dielectric Material	Polypropylene (PP), Metallized
Height - Seated (Max) [Max]	28.6 mm
Height - Seated (Max) [Max]	1.126 in
Lead Spacing	37.5 mm
Lead Spacing	1.476 in
Mounting Type	Through Hole
Operating Temperature [Max]	110 °C
Operating Temperature [Min]	-40 C
Package / Case	Radial
Ratings	AEC-Q200, X2
Size / Dimension [x]	1.634 in
Size / Dimension [x]	41.5 mm
Size / Dimension [y]	0.63 "
Size / Dimension [y]	16 mm
Termination	PC Pins
Tolerance	10 %
Voltage Rating - AC	310 V

R523W Series

Part	Applications	Dielectric Material	Capacitance	Operating Temperature [Min]	Operating Temperature [Max]	Voltage Rating - AC	Package / Case	Tolerance	Height - Seated (Max) [Max]	Height - Seated (Max) [Max]	Size / Dimension [x]	Size / Dimension [x]	Size / Dimension [y]	Size / Dimension [y]	Lead Spacing	Lead Spacing	Termination	Mounting Type	Ratings	Height - Seated (Max) [Max]	Height - Seated (Max) [Max] [z]	Height - Seated (Max) [Max] [z]
KEMET R523W447050P0K	Automotive	Polypropylene (PP) Metallized	4.7 µF	-40 C	110 °C	310 V	Radial	10 %	28.6 mm	1.126 in	1.634 in	41.5 mm	0.63 "	16 mm	37.5 mm	1.476 in	PC Pins	Through Hole	AEC-Q200 X2
KEMET R523W522050P0K	Automotive	Polypropylene (PP) Metallized	22 µF	-40 C	110 °C	310 V	Radial	10 %		45.1 mm	1.634 in	41.5 mm	1.181 in	30 mm	37.5 mm	1.476 in	PC Pins	Through Hole	AEC-Q200 X2	1.776 in
KEMET R523W433050P0K	Automotive	Polypropylene (PP) Metallized	3.3 µF	-40 C	110 °C	310 V	Radial	10 %		24.1 mm	1.634 in	41.5 mm	0.512 "	13 mm	37.5 mm	1.476 in	PC Pins	Through Hole	AEC-Q200 X2	0.949 in
KEMET R523W468050P0K	Automotive	Polypropylene (PP) Metallized	6.8 µF	-40 C	110 °C	310 V	Radial	10 %			1.634 in	41.5 mm	0.748 in	19 mm	37.5 mm	1.476 in	PC Pins	Through Hole	AEC-Q200 X2		1.264 "	32.1 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

4.7 µF Film Capacitor 310V 630V Polypropylene (PP), Metallized Radial

Technical documentation and resources