Deep-Dive with AI
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Deep-Dive with AI
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Technical Specifications
Parameters and characteristics for this part
| Specification | 28-1518-11H |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 0.25 µm |
| Contact Finish Thickness - Mating | 10 µin |
| Contact Finish Thickness - Post | 10 Áin |
| Contact Finish Thickness - Post | 0.25 çm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Current Rating (Amps) | 3 A |
| Features | Open Frame |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 28 |
| Pitch - Mating | 0.1 " |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 0.1 in |
| Pitch - Post | 2.54 mm |
| Termination | Solder |
| Termination Post Length | 0.125 in |
| Termination Post Length | 3.18 mm |
| Type | DIP |
| Type | 5.08 mm |
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Type | Type | Contact Material - Post [custom] | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Termination | Housing Material | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Features | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | 200 µin | 5.08 µm | Beryllium Copper | DIP | 5.08 mm | Brass | Tin | 0.25 µm | 10 µin | Through Hole | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | 28 | Open Frame | Gold |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | 10 Áin | 0.25 çm | Beryllium Copper | DIP | 5.08 mm | Brass | Gold | 0.25 µm | 10 µin | Through Hole | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | 28 | Open Frame | Gold |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | 10 Áin | 0.25 çm | Beryllium Copper | DIP | 5.08 mm | Brass | Gold | 0.25 µm | 10 µin | Through Hole | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | 28 | Open Frame | Gold |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | 200 µin | 5.08 µm | Beryllium Copper | DIP | 5.08 mm | Brass | Tin | 0.25 µm | 10 µin | Through Hole | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | 28 | Open Frame | Gold |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | 200 µin | 5.08 µm | Beryllium Copper | DIP | 5.08 mm | Brass | Tin | 0.25 µm | 10 µin | Through Hole | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | 28 | Open Frame | Gold |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 71 | $ 6.83 | |
| N/A | 0 | $ 7.74 | ||
Description
General part information
28-1518 Series
28 (2 x 14) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
Documents
Technical documentation and resources