Zenode.ai Logo
32-TFQFN Exposed Pad
RF and Wireless

HMC516LC5TR

Active
Analog Devices Inc./Maxim Integrated

RF AMPLIFIER, 9GHZ TO 18GHZ, 18 DB GAIN, LCC-32, -40 °C TO 85 °C

Deep-Dive with AI

Search across all available documentation for this part.

32-TFQFN Exposed Pad
RF and Wireless

HMC516LC5TR

Active
Analog Devices Inc./Maxim Integrated

RF AMPLIFIER, 9GHZ TO 18GHZ, 18 DB GAIN, LCC-32, -40 °C TO 85 °C

Technical Specifications

Parameters and characteristics for this part

SpecificationHMC516LC5TR
Current - Supply88 mA
Frequency [Max]18 GHz
Frequency [Min]9 GHz
Gain20.5 dB
Mounting TypeSurface Mount
Noise Figure2 dB
P1dB14 dBm
Package / Case32-TFQFN Exposed Pad
RF TypeGeneral Purpose
Supplier Device Package32-QFN (5x5)
Voltage - Supply [Max]3.5 V
Voltage - Supply [Min]2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated
DigikeyCut Tape (CT) 1$ 84.76<3d
10$ 74.51
25$ 70.97
Tape & Reel (TR) 100$ 66.11<3d
NewarkEach (Supplied on Cut Tape) 1$ 75.081m+
10$ 65.88
25$ 62.83
50$ 61.68
100$ 56.73
300$ 55.81

Description

General part information

HMC516 Series

The HMC516 chip is a high dynamic range GaAs PHEMT MMIC Low Noise Amplifier (LNA) which covers the 7 to 17 GHz frequency range. The HMC516 provides 20 dB of small signal gain, 1.8 dB of noise figure and has an output IP3 greater than +20 dBm. The chip can easily be integrated into hybrid or MCM assemblies due to its small size. All data is tested with the chip in a 50 Ohm test fixture connected via 0.075mm (3 mil) ribbon bonds of minimal length 0.31 mm (12 mil). Two 0.025 mm (1 mil) diameter bondwires may also be used to make the RFIN and RFOUT connections.ApplicationsPoint-to-Point RadiosPoint-to-Multi-Point Radios & VSATTest Equipment and SensorsMilitary & Space