Specification	HMC516-SX

Current - Supply	65 mA
Frequency [Max]	18 GHz
Frequency [Min]	9 GHz
Gain	20 dBi
Mounting Type	Surface Mount
Noise Figure	2 dB
P1dB	13 dBm
Package / Case	Die
RF Type	VSAT, DBS
Supplier Device Package	Die
Test Frequency [Max]	12 GHz
Test Frequency [Min]	9 GHz
Voltage - Supply	3 V

HMC516 Series

Low Noise Amplifier Chip, 7 - 17 GHz

Part	Mounting Type	Voltage - Supply	Supplier Device Package	RF Type	Test Frequency [Min]	Test Frequency [Max]	Noise Figure	Gain	Frequency [Max]	Frequency [Min]	Package / Case	Current - Supply	P1dB	Voltage - Supply [Min]	Voltage - Supply [Max]	For Use With/Related Products	Supplied Contents	Contents	Type	Utilized IC / Part
Analog Devices Inc./Maxim Integrated HMC516-SX	Surface Mount	3 V	Die	DBS VSAT	9 GHz	12 GHz	2 dB	20 dBi	18 GHz	9 GHz	Die	65 mA	13 dBm
Analog Devices Inc./Maxim Integrated HMC516LC5	Surface Mount		32-QFN (5x5)	General Purpose			2 dB	20.5 dB	18 GHz	9 GHz	32-TFQFN Exposed Pad	88 mA	14 dBm	2.5 V	3.5 V
Analog Devices Inc./Maxim Integrated HMC516LC5TR	Surface Mount		32-QFN (5x5)	General Purpose			2 dB	20.5 dB	18 GHz	9 GHz	32-TFQFN Exposed Pad	88 mA	14 dBm	2.5 V	3.5 V
Analog Devices Inc./Maxim Integrated 110431-HMC516LC5									18 GHz	9 GHz						HMC516LC5	Board(s)	Board(s)	Amplifier	HMC516LC5

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

Digikey	Tray	2	$ 131.99	<3d
		4	$ 127.07
		6	$ 124.32
		10	$ 121.00
		14	$ 118.89
		20	$ 116.72
		50	$ 111.44

Description

General part information

HMC516 Series

The HMC516 chip is a high dynamic range GaAs PHEMT MMIC Low Noise Amplifier (LNA) which covers the 7 to 17 GHz frequency range. The HMC516 provides 20 dB of small signal gain, 1.8 dB of noise figure and has an output IP3 greater than +20 dBm. The chip can easily be integrated into hybrid or MCM assemblies due to its small size. All data is tested with the chip in a 50 Ohm test fixture connected via 0.075mm (3 mil) ribbon bonds of minimal length 0.31 mm (12 mil). Two 0.025 mm (1 mil) diameter bondwires may also be used to make the RFIN and RFOUT connections.ApplicationsPoint-to-Point RadiosPoint-to-Multi-Point Radios & VSATTest Equipment and SensorsMilitary & Space

Documents

Technical documentation and resources

HMC516-SX | Datasheet

Datasheet

HMC516 Die Data Sheet

Data Sheet