SST26VF064B-104I/S70S

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Microchip Technology

IC FLASH 64MBIT SPI/QUAD WAFER

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Integrated Circuits (ICs)

SST26VF064B-104I/S70S

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Microchip Technology

IC FLASH 64MBIT SPI/QUAD WAFER

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Technical Specifications

Parameters and characteristics for this part

Specification	SST26VF064B-104I/S70S

Clock Frequency	104 MHz
Memory Format	FLASH
Memory Interface	SPI - Quad I/O
Memory Organization	8M x 8
Memory Size	64 Gbit
Memory Type	Non-Volatile
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	Die
Supplier Device Package	Wafer
Technology	FLASH
Voltage - Supply [Max]	3.6 V
Voltage - Supply [Min]	2.7 V
Write Cycle Time - Word, Page [custom]	1.5 ms
Write Cycle Time - Word, Page [custom]	1.5 ms

SST26VF064BEUI Series

64Mbit Serial Quad I/O (SQI) Flash with EUI

Part	Memory Type	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Memory Format	Technology	Supplier Device Package	Memory Organization	Write Cycle Time - Word, Page [custom]	Write Cycle Time - Word, Page [custom]	Package / Case [x]	Package / Case	Package / Case [y]	Voltage - Supply [Min]	Voltage - Supply [Max]	Memory Interface	Clock Frequency	Memory Size
Microchip Technology SST26VF064BT-104I/SO	Non-Volatile	85 °C	-40 °C	Surface Mount	FLASH	FLASH	16-SOIC	8M x 8	1.5 ms	1.5 ms	0.295 in	16-SOIC	7.5 mm	2.7 V	3.6 V	SPI - Quad I/O	104 MHz	64 Gbit
Microchip Technology SST26VF064B-104I/MN	Non-Volatile	85 °C	-40 °C	Surface Mount	FLASH	FLASH	8-WDFN (6x8)	8M x 8	1.5 ms	1.5 ms		8-WDFN Exposed Pad		2.7 V	3.6 V	SPI - Quad I/O	104 MHz	64 Gbit
Microchip Technology SST26VF064BEUI-104I/SM	Non-Volatile	85 °C	-40 °C	Surface Mount	FLASH	FLASH	8-SOIJ	8M x 8	1.5 ms	1.5 ms	0.209 "	8-SOIC	5.3 mm	2.7 V	3.6 V	SPI - Quad I/O	104 MHz	64 Gbit
Microchip Technology SST26VF064BA-104I/MF	Non-Volatile	85 °C	-40 °C	Surface Mount	FLASH	FLASH	8-WDFN (5x6)	8M x 8	1.5 ms	1.5 ms		8-WDFN Exposed Pad		2.7 V	3.6 V	SPI - Quad I/O	104 MHz	64 Gbit
Microchip Technology SST26VF064B-104I/TD	Non-Volatile	85 °C	-40 °C	Surface Mount	FLASH	FLASH	24-TBGA (6x8)	8M x 8	1.5 ms	1.5 ms		24-TBGA		2.7 V	3.6 V	SPI - Quad I/O	104 MHz	64 Gbit
Microchip Technology SST26VF064BAT-104I/MF	Non-Volatile	85 °C	-40 °C	Surface Mount	FLASH	FLASH	8-WDFN (5x6)	8M x 8	1.5 ms	1.5 ms		8-WDFN Exposed Pad		2.7 V	3.6 V	SPI - Quad I/O	104 MHz	64 Gbit
Microchip Technology SST26VF064B-104I/S70S	Non-Volatile	85 °C	-40 °C		FLASH	FLASH	Wafer	8M x 8	1.5 ms	1.5 ms		Die		2.7 V	3.6 V	SPI - Quad I/O	104 MHz	64 Gbit
Microchip Technology SST26VF064BT-104I/SM	Non-Volatile	85 °C	-40 °C	Surface Mount	FLASH	FLASH	8-SOIJ	8M x 8	1.5 ms	1.5 ms	0.209 "	8-SOIC	5.3 mm	2.7 V	3.6 V	SPI - Quad I/O	104 MHz	64 Gbit
Microchip Technology SST26VF064BT-104V/MF	Non-Volatile	105 °C	-40 °C	Surface Mount	FLASH	FLASH	8-WDFN (5x6)	8M x 8	1.5 ms	1.5 ms		8-WDFN Exposed Pad		2.7 V	3.6 V	SPI - Quad I/O	104 MHz	64 Gbit
Microchip Technology SST26VF064B-104I/SO	Non-Volatile	85 °C	-40 °C	Surface Mount	FLASH	FLASH	16-SOIC	8M x 8	1.5 ms	1.5 ms	0.295 in	16-SOIC	7.5 mm	2.7 V	3.6 V	SPI - Quad I/O	104 MHz	64 Gbit

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

SST26VF064BEUI Series

The SST26VF064BA Serial Quad I/O (SQI) flash device utilizes a 4-bit multiplexed I/O serial interface to boost performance while maintaining the compact form factor of standard serial flash devices. SST26VF064BA also

support full command-set compatibility to traditional

Serial Peripheral Interface (SPI) protocol. Operating at frequencies reaching 104 MHz, the SST26VF064BA enables minimum latency execute-in-place (XIP) capability without the need for code shadowing on an SRAM. The device’s high performance and reliability make it the ideal choice for Network Appliance, DSL and Cable Modems, Wireless Lan, Computing, Digital TV, Smart Meter, Server, Set Top Box, Automotive and other Industrial applications. Further benefits are achieved with SST’s proprietary, high-performance CMOS SuperFlash® technology, which significantly improves performance and reliability, and lowers power consumption for high bandwidth, compact designs.

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Technical documentation and resources