Connectors, Interconnects

216-7224-55-1902

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3M Electronic Specialty

IC & COMPONENT SOCKET, 16 CONTACTS, SOIC SOCKET, 2.54 MM, 216-7224 SERIES, 7.62 MM

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Connectors, Interconnects

216-7224-55-1902

Active

3M Electronic Specialty

IC & COMPONENT SOCKET, 16 CONTACTS, SOIC SOCKET, 2.54 MM, 216-7224 SERIES, 7.62 MM

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	216-7224-55-1902

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30 µin
Contact Finish Thickness - Post	0.76 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyethersulfone (PES), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	16
Number of Positions or Pins (Grid) [custom]	2
Number of Positions or Pins (Grid) [custom]	8
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-55 C
Termination	Solder
Termination Post Length	3.56 mm
Termination Post Length	0.14 in
Type	SOIC

216 Series

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Housing Material	Mounting Type	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Type	Contact Material - Post	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Features	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Type	Type	Pitch - Post	Pitch - Post
3M Electronic Specialty 216-7383-55-1902	3.56 mm	0.14 in	1 A	UL94 V-0	Polyethersulfone (PES) Glass Filled	Through Hole	Gold	-55 C	150 °C	SOIC	Beryllium Copper	Beryllium Copper	30 µin	0.76 µm	Solder	Closed Frame	2	16	8	Gold
3M Electronic Specialty 216-7224-55-1902	3.56 mm	0.14 in	1 A	UL94 V-0	Polyethersulfone (PES) Glass Filled	Through Hole	Gold	-55 C	150 °C	SOIC	Beryllium Copper	Beryllium Copper	30 µin	0.76 µm	Solder	Closed Frame	2	16	8	Gold
3M Electronic Specialty 216-3340-00-0602J	2.78 mm	0.11 in	1 A	UL94 V-0	Polysulfone (PSU) Glass Filled	Connector	Gold	-55 C	125 °C	DIP ZIF (ZIP)	Beryllium Copper	Beryllium Copper	30 µin	0.76 µm	Press-Fit	Closed Frame	2	16	8	Gold	0.76 Ám	30 Áin	0.1 "	2.54 mm	7.62 mm	0.3 in	0.1 in	2.54 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 50.61
		10	$ 39.19
		25	$ 35.57
		50	$ 33.13
		100	$ 30.91
		250	$ 28.31
	N/A	51	$ 40.81

Description

General part information

216 Series

The 216-7224-55-1902 is a 16-lead test and burn-in SOIC Socket made of glass-filled polyethersulfone. The socket lid is actuated from top or front and is compatible with automated load/unload equipment. The compact envelope and side to side stack-ability maximize board density.

Documents

Technical documentation and resources