216 Series
Manufacturer: 3M Electronic Specialty
Beta
⌘K
IC & COMPONENT SOCKET, 16 CONTACTS, SOIC SOCKET, 2.54 MM, 216-7383 SERIES, 3.81 MM
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Housing Material | Mounting Type | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Type | Contact Material - Post | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Features | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Type | Type | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 3M Electronic Specialty | 3.56 mm | 0.14 in | 1 A | UL94 V-0 | Polyethersulfone (PES) Glass Filled | Through Hole | Gold | -55 C | 150 °C | SOIC | Beryllium Copper | Beryllium Copper | 30 µin | 0.76 µm | Solder | Closed Frame | 2 | 16 | 8 | Gold | ||||||||
 3M Electronic Specialty | 3.56 mm | 0.14 in | 1 A | UL94 V-0 | Polyethersulfone (PES) Glass Filled | Through Hole | Gold | -55 C | 150 °C | SOIC | Beryllium Copper | Beryllium Copper | 30 µin | 0.76 µm | Solder | Closed Frame | 2 | 16 | 8 | Gold | ||||||||
 3M Electronic Specialty | 2.78 mm | 0.11 in | 1 A | UL94 V-0 | Polysulfone (PSU) Glass Filled | Connector | Gold | -55 C | 125 °C | DIP ZIF (ZIP) | Beryllium Copper | Beryllium Copper | 30 µin | 0.76 µm | Press-Fit | Closed Frame | 2 | 16 | 8 | Gold | 0.76 Ám | 30 Áin | 0.1 " | 2.54 mm | 7.62 mm | 0.3 in | 0.1 in | 2.54 mm |