214-7390-55-1902
ActiveIC & COMPONENT SOCKET, 14 CONTACTS, SOIC SOCKET, 2.54 MM, TEXTOOL SERIES, 3.81 MM
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214-7390-55-1902
ActiveIC & COMPONENT SOCKET, 14 CONTACTS, SOIC SOCKET, 2.54 MM, TEXTOOL SERIES, 3.81 MM
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Technical Specifications
Parameters and characteristics for this part
| Specification | 214-7390-55-1902 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 30 µin |
| Contact Finish Thickness - Post | 0.76 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | Polyethersulfone (PES), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 14 |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -55 C |
| Termination | Solder |
| Termination Post Length | 3.56 mm |
| Termination Post Length | 0.14 in |
| Type | SOIC |
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Contact Resistance | Features | Contact Finish - Post | Termination | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Type | Type | Type | Housing Material | Contact Material - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material - Post | Shelf Life | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Min] | Shelf Life Start | Color | Thickness | Thickness | Thickness | Tape Type | Adhesive | Backing, Carrier | Usage | Length | Length | Length | Temperature Range | Temperature Range | Width [x] | Width [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 3M Electronic Specialty | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | 25 mOhm | Closed Frame | Gold | Press-Fit | Gold | 0.76 Ám | 30 Áin | 0.1 " | 2.54 mm | 14 | Connector | 30 µin | 0.76 µm | 0.1 in | 2.54 mm | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Polysulfone (PSU) Glass Filled | Beryllium Copper | -55 C | 125 °C | Beryllium Copper | |||||||||||||||||||||
 3M Electronic Specialty | 12 Months | 27 °C | 80 °F | 60 °F | 16 °C | Date of Manufacture | Tan | 0.0067 in | 0.17 mm | 6.7 mils | Masking | Rubber | Crepe Paper | High Temperature Adhesion | 60 yds | 55 m | 180 ft | 177 °C | 350 °F | 50.8 mm | 2 in | |||||||||||||||||||||||||||
3M Electronic Specialty | 1 A | 0.14 in | 3.56 mm | UL94 V-0 | Closed Frame | Gold | Solder | Gold | 14 | Through Hole | 30 µin | 0.76 µm | SOIC | Polyethersulfone (PES) Glass Filled | Beryllium Copper | -55 C | 150 °C | Beryllium Copper |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 37.47 | |
| 10 | $ 32.81 | |||
| 30 | $ 31.39 | |||
| 50 | $ 30.38 | |||
| 100 | $ 29.36 | |||
| 250 | $ 27.74 | |||
| N/A | 25 | $ 37.63 | ||
Description
General part information
214 Series
The 214-7390-55-1902 is a 14-way Textool™ SOIC Socket with gold-plated beryllium copper contacts. Lid can be actuated from top or front and is compatible with automated load/unload equipment. Lid applies 80g normal force per lead for maximum electrical reliability. User friendly, compact size 3M Textool lidded socket is available for SOIC gull wing packages on 50mil centers.
Documents
Technical documentation and resources