214 Series

Catalog

CONN IC DIP SOCKET ZIF 14POS GLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Resistance	Features	Contact Finish - Post	Termination	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Type	Type	Type	Housing Material	Contact Material - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Post	Shelf Life	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Min]	Shelf Life Start	Color	Thickness	Thickness	Thickness	Tape Type	Adhesive	Backing, Carrier	Usage	Length	Length	Length	Temperature Range	Temperature Range	Width [x]	Width [x]
3M Electronic Specialty 214-3339-00-0602J	1 A	0.11 in	2.78 mm	UL94 V-0	25 mOhm	Closed Frame	Gold	Press-Fit	Gold	0.76 Ám	30 Áin	0.1 "	2.54 mm	14	Connector	30 µin	0.76 µm	0.1 in	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	Polysulfone (PSU) Glass Filled	Beryllium Copper	-55 C	125 °C	Beryllium Copper
3M Electronic Specialty 214-2"X60YD																												12 Months	27 °C	80 °F	60 °F	16 °C	Date of Manufacture	Tan	0.0067 in	0.17 mm	6.7 mils	Masking	Rubber	Crepe Paper	High Temperature Adhesion	60 yds	55 m	180 ft	177 °C	350 °F	50.8 mm	2 in
3M Electronic Specialty 214-7390-55-1902	1 A	0.14 in	3.56 mm	UL94 V-0		Closed Frame	Gold	Solder	Gold					14	Through Hole	30 µin	0.76 µm			SOIC			Polyethersulfone (PES) Glass Filled	Beryllium Copper	-55 C	150 °C	Beryllium Copper