CYW20819A1KFBGT
ActiveBLUETOOTH MODULE, BLE 5.2, 3 MBPS, -94.5 DBM, 1.71 TO 3.3 V, -30 °C TO 85 °C, AIROC SERIES
Deep-Dive with AI
Search across all available documentation for this part.
CYW20819A1KFBGT
ActiveBLUETOOTH MODULE, BLE 5.2, 3 MBPS, -94.5 DBM, 1.71 TO 3.3 V, -30 °C TO 85 °C, AIROC SERIES
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | CYW20819A1KFBGT |
|---|---|
| Current - Receiving [Max] | 6.69 mA |
| Current - Receiving [Min] | 6.1 mA |
| Current - Transmitting [Max] | 11.28 mA |
| Current - Transmitting [Min] | 6.16 mA |
| Data Rate (Max) | 3 Mbps |
| Frequency | 2.4 GHz |
| GPIO | 22 |
| Memory Size | 160 kB, 256 kB |
| Modulation | GFSK |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -30 °C |
| Package / Case | 62-WFBGA |
| Power - Output | 5 dBm |
| Protocol | Bluetooth v5.2, Class 2 |
| RF Family/Standard | General ISM > 1GHz, Bluetooth |
| Sensitivity | -95 dBm |
| Serial Interfaces | HCI, SPI, I2S, GPIO, I2C, PWM, UART |
| Supplier Device Package | 62-FBGA (4.5x4.5) |
| Type | TxRx + MCU |
| Voltage - Supply [Max] | 1.26 V |
| Voltage - Supply [Min] | 1.045 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 5.77 | |
| 10 | $ 5.15 | |||
| 25 | $ 4.64 | |||
| 100 | $ 4.22 | |||
| 250 | $ 3.81 | |||
| 500 | $ 3.42 | |||
| 1000 | $ 2.88 | |||
| Digi-Reel® | 1 | $ 5.77 | ||
| 10 | $ 5.15 | |||
| 25 | $ 4.64 | |||
| 100 | $ 4.22 | |||
| 250 | $ 3.81 | |||
| 500 | $ 3.42 | |||
| 1000 | $ 2.88 | |||
| N/A | 4794 | $ 4.93 | ||
| Tape & Reel (TR) | 5000 | $ 2.55 | ||
| Newark | Each (Supplied on Cut Tape) | 1 | $ 6.18 | |
| 10 | $ 4.86 | |||
| 25 | $ 4.42 | |||
| 50 | $ 4.15 | |||
| 100 | $ 3.87 | |||
| 250 | $ 3.59 | |||
| 500 | $ 3.39 | |||
| 1000 | $ 3.22 | |||
Description
General part information
CYW20819 Series
The AIROC™ CYW20819 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20819 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® solutions. The AIROC™ CYW20819 Bluetooth® & Bluetooth® LE SoC is designed to support a wide spectrum of Bluetooth® use cases for home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or any Bluetooth® connected IoT application. AIROC™ CYW20819 Modules Infineon's AIROC™ CYW20819 Bluetooth® & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20819 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™CYBT-213043-02,CYBT-223058-02,CYBT-263064-02,CYBT-263065-02,CYBT-273063-02are supported by the AIROC™ Bluetooth® SDK in ModusToolbox™ software and tools with code examples to support rapid development of embedded Bluetooth® LE applications.
Documents
Technical documentation and resources
