Specification	10039755-10110TLF

Card Thickness	1.57 mm
Card Thickness	0.062 in
Card Type	PCI Express™
Color	Black
Contact Finish	Gold
Contact Finish Thickness	0.38 µm
Contact Finish Thickness	15 µin
Contact Material	Copper Alloy
Contact Type	Cantilever
Features	Locking Ramp, Board Guide
Gender	Female
Material - Insulation	Nylon, Glass Filled, Polyamide (PA)
Mounting Type	Through Hole
Number of Positions	36
Number of Rows [custom]	2
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-55 C
Pitch	1 mm
Pitch	0.039 in
Read Out	Dual
Termination	Solder, Staggered

10039755 Series

Part	Material - Insulation	Color	Number of Rows [custom]	Card Type	Features	Contact Finish Thickness	Contact Finish Thickness	Contact Type	Contact Finish	Termination	Pitch	Pitch	Read Out	Number of Positions	Gender	Mounting Type	Contact Material	Operating Temperature [Min]	Operating Temperature [Max]	Card Thickness	Card Thickness	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]	Pitch [x]	Pitch [x]	Number of Positions/Bay/Row
Amphenol ICC (FCI) 10039755-10011TLF	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	30 Áin	0.76 Ám	Cantilever	Gold	Solder Staggered	1 mm	0.039 in	Dual	64	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in
Amphenol ICC (FCI) 10039755-10111TLF	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	15 µin	0.38 µm	Cantilever	Gold	Press-Fit	1 mm	0.039 in	Dual	64	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in	21	11
Amphenol ICC (FCI) 10039755-10012T	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	30 Áin	0.76 Ám	Cantilever	Gold	Press-Fit			Dual	98	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in			0.079 in	2 mm	49
Amphenol ICC (FCI) 10039755-10113TLF	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	15 µin	0.38 µm	Cantilever	Gold	Press-Fit	1 mm	0.039 in	Dual	164	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in
Amphenol ICC (FCI) 10039755-10110TLF	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	15 µin	0.38 µm	Cantilever	Gold	Solder Staggered	1 mm	0.039 in	Dual	36	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in
Amphenol ICC (FCI) 10039755-10311T	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	30 Áin	0.76 Ám	Cantilever	Gold	Solder Staggered	1 mm	0.039 in	Dual	64	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in
Amphenol ICC (FCI) 10039755-10003TLF	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	30 Áin	0.76 Ám	Cantilever	Gold	Press-Fit	1 mm	0.039 in	Dual	164	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in
Amphenol ICC (FCI) 10039755-10102TLF	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	15 µin	0.38 µm	Cantilever	Gold	Solder Staggered	1 mm	0.039 in	Dual	98	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in
Amphenol ICC (FCI) 10039755-10312T	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	30 Áin	0.76 Ám	Cantilever	Gold	Solder Staggered	1 mm	0.039 in	Dual	98	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in
Amphenol ICC (FCI) 10039755-10002TLF	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	30 Áin	0.76 Ám	Cantilever	Gold	Solder Staggered	1 mm	0.039 in	Dual	98	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in