10039755 Series

Catalog

CONN PCI EXP FMALE 64POS 0.039

Part	Material - Insulation	Color	Number of Rows [custom]	Card Type	Features	Contact Finish Thickness	Contact Finish Thickness	Contact Type	Contact Finish	Termination	Pitch	Pitch	Read Out	Number of Positions	Gender	Mounting Type	Contact Material	Operating Temperature [Min]	Operating Temperature [Max]	Card Thickness	Card Thickness	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]	Pitch [x]	Pitch [x]	Number of Positions/Bay/Row
Amphenol ICC (FCI) 10039755-10011TLF	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	30 Áin	0.76 Ám	Cantilever	Gold	Solder Staggered	1 mm	0.039 in	Dual	64	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in
Amphenol ICC (FCI) 10039755-10111TLF	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	15 µin	0.38 µm	Cantilever	Gold	Press-Fit	1 mm	0.039 in	Dual	64	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in	21	11
Amphenol ICC (FCI) 10039755-10012T	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	30 Áin	0.76 Ám	Cantilever	Gold	Press-Fit			Dual	98	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in			0.079 in	2 mm	49
Amphenol ICC (FCI) 10039755-10113TLF	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	15 µin	0.38 µm	Cantilever	Gold	Press-Fit	1 mm	0.039 in	Dual	164	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in
Amphenol ICC (FCI) 10039755-10110TLF	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	15 µin	0.38 µm	Cantilever	Gold	Solder Staggered	1 mm	0.039 in	Dual	36	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in
Amphenol ICC (FCI) 10039755-10311T	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	30 Áin	0.76 Ám	Cantilever	Gold	Solder Staggered	1 mm	0.039 in	Dual	64	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in
Amphenol ICC (FCI) 10039755-10003TLF	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	30 Áin	0.76 Ám	Cantilever	Gold	Press-Fit	1 mm	0.039 in	Dual	164	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in
Amphenol ICC (FCI) 10039755-10102TLF	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	15 µin	0.38 µm	Cantilever	Gold	Solder Staggered	1 mm	0.039 in	Dual	98	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in
Amphenol ICC (FCI) 10039755-10312T	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	30 Áin	0.76 Ám	Cantilever	Gold	Solder Staggered	1 mm	0.039 in	Dual	98	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in
Amphenol ICC (FCI) 10039755-10002TLF	Glass Filled Nylon Polyamide (PA)	Black	2	PCI Express™	Board Guide Locking Ramp	30 Áin	0.76 Ám	Cantilever	Gold	Solder Staggered	1 mm	0.039 in	Dual	98	Female	Through Hole	Copper Alloy	-55 C	85 °C	1.57 mm	0.062 in