
Isolators
PS2811-1-V-F3-A
ActiveRenesas Electronics Corporation
OPTOCOUPLER DC-IN 1-CH TRANSISTOR DC-OUT 4-PIN SSOP EMBOSSED T/R
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DocumentsPS2811-1,-PS2811-4 Data Sheet

Isolators
PS2811-1-V-F3-A
ActiveRenesas Electronics Corporation
OPTOCOUPLER DC-IN 1-CH TRANSISTOR DC-OUT 4-PIN SSOP EMBOSSED T/R
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DocumentsPS2811-1,-PS2811-4 Data Sheet
Technical Specifications
Parameters and characteristics for this part
| Specification | PS2811-1-V-F3-A |
|---|---|
| Current - DC Forward (If) (Max) | 50 mA |
| Current - Output / Channel [custom] | 40 mA |
| Current Transfer Ratio (Max) | 400 % |
| Current Transfer Ratio (Min) [Min] | 100 % |
| Input Type | DC |
| Mounting Type | Surface Mount |
| Number of Channels | 1 |
| Operating Temperature [Max] | 100 °C |
| Operating Temperature [Min] | -55 °C |
| Output Type | 1.81 mOhm |
| Package / Case | 4-SOIC |
| Package / Case [x] | 0.173 in |
| Package / Case [y] | 4.4 mm |
| Rise / Fall Time (Typ) [custom] | 4 µs |
| Rise / Fall Time (Typ) [custom] | 5 µs |
| Supplier Device Package | 4-SSOP |
| Vce Saturation (Max) [Max] | 300 mV |
| Voltage - Forward (Vf) (Typ) | 1.15 V |
| Voltage - Isolation | 2500 Vrms |
| Voltage - Output (Max) [Max] | 40 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 1.04 | |
| 10 | $ 0.66 | |||
| 100 | $ 0.49 | |||
| 500 | $ 0.45 | |||
| 1000 | $ 0.37 | |||
| Digi-Reel® | 1 | $ 1.04 | ||
| 10 | $ 0.66 | |||
| 100 | $ 0.49 | |||
| 500 | $ 0.45 | |||
| 1000 | $ 0.37 | |||
| Tape & Reel (TR) | 3500 | $ 0.35 | ||
| 3500 | $ 0.34 | |||
| 7000 | $ 0.34 | |||
| 7000 | $ 0.33 | |||
| 10500 | $ 0.33 | |||
| 10500 | $ 0.32 | |||
| 24500 | $ 0.32 | |||
| 24500 | $ 0.33 | |||
Description
General part information
PS2811-1 Series
The PS2811-1 and PS2811-4 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon phototransistor in a plastic SSOP for high density applications. The package is a Shrink SOP (Small Outline Package) type for high density mounting applications.
Documents
Technical documentation and resources