PS2811-1 Series

LOW Input Current, High CTR 4, 16-PIN SSOP Photocoupler

Manufacturer: Renesas Electronics Corporation

Catalog

LOW Input Current, High CTR 4, 16-PIN SSOP Photocoupler

Part	Rise / Fall Time (Typ) [custom]	Rise / Fall Time (Typ) [custom]	Voltage - Forward (Vf) (Typ)	Voltage - Isolation	Current Transfer Ratio (Max)	Number of Channels	Current Transfer Ratio (Min) [Min]	Output Type	Current - Output / Channel [custom]	Mounting Type	Supplier Device Package	Current - DC Forward (If) (Max)	Operating Temperature [Max]	Operating Temperature [Min]	Input Type	Vce Saturation (Max) [Max]	Voltage - Output (Max) [Max]	Package / Case [y]	Package / Case	Package / Case [x]
Renesas Electronics Corporation PS2811-1-V-F3-A	4 µs	5 µs	1.15 V	2500 Vrms	400 %	1	100 %	1.81 mOhm	40 mA	Surface Mount	4-SSOP	50 mA	100 °C	-55 °C	DC	300 mV	40 V	4.4 mm	4-SOIC	0.173 in
Renesas Electronics Corporation PS2811-4-A	4 µs	5 µs	1.15 V	2500 Vrms	400 %	4	100 %	1.81 mOhm	40 mA	Surface Mount	16-SSOP	50 mA	100 °C	-55 °C	DC	300 mV	40 V		16-SOIC
Renesas Electronics Corporation PS2811-4-V-A	4 µs	5 µs	1.15 V	2500 Vrms	400 %	4	100 %	1.81 mOhm	40 mA	Surface Mount	16-SSOP	50 mA	100 °C	-55 °C	DC	300 mV	40 V		16-SOIC
Renesas Electronics Corporation PS2811-1-V-L-A	4 µs	5 µs	1.15 V	2500 Vrms	300 %	1	150 %	1.81 mOhm	40 mA	Surface Mount	4-SSOP	50 mA	100 °C	-55 °C	DC	300 mV	40 V	4.4 mm	4-SOIC	0.173 in
Renesas Electronics Corporation PS2811-1-K-A	4 µs	5 µs	1.15 V	2500 Vrms	400 %	1	200 %	1.81 mOhm	40 mA	Surface Mount	4-SSOP	50 mA	100 °C	-55 °C	DC	300 mV	40 V	4.4 mm	4-SOIC	0.173 in
Renesas Electronics Corporation PS2811-4-V-F3-A	4 µs	5 µs	1.15 V	2500 Vrms	400 %	4	100 %	1.81 mOhm	40 mA	Surface Mount	16-SSOP	50 mA	100 °C	-55 °C	DC	300 mV	40 V		16-SOIC
Renesas Electronics Corporation PS2811-1-H-A	4 µs	5 µs	1.15 V	2500 Vrms	400 %	1	100 %	1.81 mOhm	40 mA	Surface Mount	4-SSOP	50 mA	100 °C	-55 °C	DC	300 mV	40 V	4.4 mm	4-SOIC	0.173 in

Catalog

LOW Input Current, High CTR 4, 16-PIN SSOP Photocoupler

Description

The PS2811-1 and PS2811-4 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon phototransistor in a plastic SSOP for high density applications. The package is a Shrink SOP (Small Outline Package) type for high density mounting applications.