Deep-Dive with AI
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Deep-Dive with AI
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Technical Specifications
Parameters and characteristics for this part
| Specification | 8080-1G9 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Features | Closed Frame |
| Housing Material | Fluoropolymer (FP) |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 4 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 C |
| Termination | Solder |
| Type | Transistor, TO-3 |
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Type | Housing Material | Termination | Contact Material - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Contact Material - Mating | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish - Mating | Contact Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 TE Connectivity AMP Connectors | -55 C | 125 °C | 5.08 µm | 200 µin | Closed Frame | Transistor TO-3 | Polytetrafluoroethylene (PTFE) | Solder | Beryllium Copper | Tin | 200 µin | 5.08 µm | Chassis Mount | Beryllium Copper | 3 | |||
 TE Connectivity AMP Connectors | -55 C | 125 °C | 5.08 µm | 200 µin | Closed Frame | Transistor TO-3 | Phenolic | Solder | Beryllium Copper | Tin-Lead | Through Hole | Beryllium Copper | 3 | UL94 V-0 | Tin-Lead | |||
TE Connectivity AMP Connectors | -55 C | 125 °C | Closed Frame | Transistor TO-3 | Fluoropolymer (FP) | Solder | Beryllium Copper | Gold | Through Hole | Beryllium Copper | 4 | Gold | ||||||
TE Connectivity AMP Connectors | -55 C | 125 °C | Closed Frame | Transistor TO-3 | Polytetrafluoroethylene (PTFE) | Solder | Beryllium Copper | Tin | Chassis Mount | Beryllium Copper | 3 | |||||||
TE Connectivity AMP Connectors | -55 C | 125 °C | 5.08 µm | 200 µin | Closed Frame | Transistor TO-3 | Diallyl Phthalate (DAP) | Solder | Beryllium Copper | Tin-Lead | 20 µin | 0.51 µm | Chassis Mount | Beryllium Copper | 3 | UL94 V-0 | Tin-Lead | 25 mOhm |
TE Connectivity AMP Connectors | -55 C | 125 °C | 12.7 µm | 500 µin | Closed Frame | Transistor TO-3 | Diallyl Phthalate (DAP) | Solder | Beryllium Copper | Silver | 500 µin | 12.7 µm | Chassis Mount | Beryllium Copper | 3 | UL94 V-0 | Silver | |
TE Connectivity AMP Connectors | -55 C | 125 °C | Closed Frame | Transistor TO-3 | Polytetrafluoroethylene (PTFE) | Solder | Beryllium Copper | Tin | Chassis Mount | Beryllium Copper | 3 | |||||||
TE Connectivity AMP Connectors | -55 C | 125 °C | Closed Frame | Transistor TO-3 | Polytetrafluoroethylene (PTFE) | Solder | Beryllium Copper | Tin-Lead | Chassis Mount | Beryllium Copper | 3 | Tin-Lead | ||||||
 TE Connectivity AMP Connectors | -55 C | 125 °C | Closed Frame | Transistor TO-3 | Polytetrafluoroethylene (PTFE) | Solder | Beryllium Copper | Silver | Chassis Mount | Beryllium Copper | 3 | Silver | ||||||
TE Connectivity AMP Connectors | -55 C | 125 °C | Closed Frame | Transistor TO-3 | Polytetrafluoroethylene (PTFE) | Solder | Beryllium Copper | Gold | Chassis Mount | Beryllium Copper | 3 | Gold |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
| Digikey | Bulk | 400 | $ 19.91 | 1m+ |
| N/A | 0 | $ 0.00 | 1m+ | |
Description
General part information
8080 Series
4 (Round) Pos Transistor, TO-3 Socket Gold Through Hole
Documents
Technical documentation and resources