The 122-10CC is a Thermal Joint Compound, stable, silicone based, thixotropic paste developed to provide premium performance. It is formulated to significantly reduce contact thermal resistance where power densities are concentrated in devices such as flip chip, reduced die size and 'overclock’ microprocessors. When applied as a thin film between a Wakefield heat sink and device it possesses superior thermal conductivity compared to traditional 'grease’. It is compatible with automated or manual dispensing methods.