
Connectors, Interconnects
2102061-4
ActiveTE Connectivity AMP Connectors
CONN HIGH SPEED MEZZANINE RCP 114 POS 1.27MM SOLDER BALL ST SMD VITA 61 T/R
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Connectors, Interconnects
2102061-4
ActiveTE Connectivity AMP Connectors
CONN HIGH SPEED MEZZANINE RCP 114 POS 1.27MM SOLDER BALL ST SMD VITA 61 T/R
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | 2102061-4 |
|---|---|
| Applications | General Purpose, Military |
| Connector Type | Receptacle |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 50 µin |
| Contact Finish Thickness - Mating | 1.27 µm |
| Contact Material | Beryllium Copper |
| Contact Shape | Square |
| Contact Type | Female Socket |
| Fastening Type | Push-Pull |
| Features | Pick and Place |
| Insulation Color | Natural |
| Insulation Height | 8 mm |
| Insulation Height | 0.315 in |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Mated Stacking Heights | 12 mm |
| Mounting Type | Surface Mount |
| Number of Positions | 114 |
| Number of Positions Loaded | All |
| Number of Rows | 6 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 C |
| Pitch - Mating | 1.27 mm |
| Pitch - Mating | 0.05 in |
| Row Spacing - Mating | 0.05 in |
| Row Spacing - Mating | 1.27 mm |
| Termination | Solder |
| Voltage Rating | 250 VAC |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
AMP Mezalok Series
PCB Mount Receptacle, Vertical, Board-to-Board, 114 Position, 1.27 mm [.05 in] Centerline, Gold (Au), Surface Mount - Solder Ball, Signal, AMP Mezalok
Documents
Technical documentation and resources