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Discrete Semiconductor Products

RFV12TG6SGC9

Active
Rohm Semiconductor

DIODE GP 600V 12A TO220ACFP

Product dimension image
Discrete Semiconductor Products

RFV12TG6SGC9

Active
Rohm Semiconductor

DIODE GP 600V 12A TO220ACFP

Technical Specifications

Parameters and characteristics for this part

SpecificationRFV12TG6SGC9
Current - Average Rectified (Io)12 A
Current - Reverse Leakage @ Vr10 µA
Mounting TypeThrough Hole
Operating Temperature - Junction150 °C
Package / CaseTO-220-2
Reverse Recovery Time (trr)45 ns
Speed200 mA, 500 ns
Supplier Device PackageTO-220ACFP
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If2.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 1.08
10$ 0.90
100$ 0.72
500$ 0.65

Description

General part information

RFV12TG6S Series

RFV12TG6S is the silicon epitaxial planar type Fast Recovery Diode for PFC.

Documents

Technical documentation and resources

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Power Loss and Thermal Design of Diodes

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

What Is Thermal Design

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Taping Information

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Diode Types and Applications

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Part Explanation

Application Note

About Flammability of Materials

Environmental Data

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

ESD Data

Characteristics Data

How to Create Symbols for PSpice Models

Models

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Explanation for Marking

Package Information

Reliability Test Result

Manufacturing Data

Package Dimensions

Package Information

Inner Structure

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Export Regulations

Export Information

List of Diode Package Thermal Resistance

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Select Rectifier Diodes

Technical Article