Connectors, Interconnects

558-10-432M31-001101

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Preci-Dip

PGA SOLDER TAIL 1.27MM

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Connectors, Interconnects

558-10-432M31-001101

Active

Preci-Dip

PGA SOLDER TAIL 1.27MM

Deep-Dive with AI

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	558-10-432M31-001101

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 Áin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Contact Resistance	10 mOhm
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	FR4 Epoxy Glass
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	432
Number of Positions or Pins (Grid) [x]	31
Number of Positions or Pins (Grid) [y]	31
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	1.27 mm
Pitch - Mating	0.05 in
Pitch - Post	0.05 in
Pitch - Post	1.27 mm
Termination	Solder
Termination Post Length	2.83 mm
Termination Post Length	0.111 in
Type	PGA

558-10 Series

Part	Contact Resistance	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Contact Finish - Mating	Termination	Mounting Type	Contact Finish - Post	Pitch - Post	Pitch - Post	Type	Housing Material	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Material - Post [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]
Preci-Dip 558-10-255M16-001101	10 mOhm	2.83 mm	0.111 in	1 A	UL94 V-0	Gold	Solder	Through Hole	Gold	0.05 in	1.27 mm	PGA	FR4 Epoxy Glass	1.27 mm	0.05 in	16x16	255	Closed Frame	0.25 µm	10 µin	Beryllium Copper	Brass	10 Áin	0.25 çm	-55 C	125 °C
Preci-Dip 558-10-576M30-001104	10 mOhm	2.2 mm	0.086 in	1 A	UL94 V-0	Gold	Solder	Surface Mount	Gold	0.05 in	1.27 mm	BGA	FR4 Epoxy Glass	1.27 mm	0.05 in		576	Closed Frame	0.25 µm	10 µin	Brass	Brass	10 Áin	0.25 çm	-55 C	125 °C	30 x 30
Preci-Dip 558-10-420M26-001104	10 mOhm	2.2 mm	0.086 in	1 A	UL94 V-0	Gold	Solder	Surface Mount	Gold	0.05 in	1.27 mm	BGA	FR4 Epoxy Glass	1.27 mm	0.05 in		420	Closed Frame	0.25 µm	10 µin	Brass	Brass	10 Áin	0.25 çm	-55 C	125 °C
Preci-Dip 558-10-500M30-001104	10 mOhm	2.2 mm	0.086 in	1 A	UL94 V-0	Gold	Solder	Surface Mount	Gold	0.05 in	1.27 mm	BGA	FR4 Epoxy Glass	1.27 mm	0.05 in		500	Closed Frame	0.25 µm	10 µin	Brass	Brass	10 Áin	0.25 çm	-55 C	125 °C		30	30
Preci-Dip 558-10-480M29-001101	10 mOhm	2.83 mm	0.111 in	1 A	UL94 V-0	Gold	Solder	Through Hole	Gold	0.05 in	1.27 mm	PGA	FR4 Epoxy Glass	1.27 mm	0.05 in		480	Closed Frame	0.25 µm	10 µin	Beryllium Copper	Brass	10 Áin	0.25 çm	-55 C	125 °C		29	29
Preci-Dip 558-10-388M26-001101	10 mOhm	2.83 mm	0.111 in	1 A	UL94 V-0	Gold	Solder	Through Hole	Gold	0.05 in	1.27 mm	PGA	FR4 Epoxy Glass	1.27 mm	0.05 in		388	Closed Frame	0.25 µm	10 µin	Beryllium Copper	Brass	10 Áin	0.25 çm	-55 C	125 °C
Preci-Dip 558-10-432M31-001101	10 mOhm	2.83 mm	0.111 in	1 A	UL94 V-0	Gold	Solder	Through Hole	Gold	0.05 in	1.27 mm	PGA	FR4 Epoxy Glass	1.27 mm	0.05 in		432	Closed Frame	0.25 µm	10 µin	Beryllium Copper	Brass	10 Áin	0.25 çm	-55 C	125 °C		31	31
Preci-Dip 558-10-576M30-001101	10 mOhm	2.83 mm	0.111 in	1 A	UL94 V-0	Gold	Solder	Through Hole	Gold	0.05 in	1.27 mm	PGA	FR4 Epoxy Glass	1.27 mm	0.05 in		576	Closed Frame	0.25 µm	10 µin	Beryllium Copper	Brass	10 Áin	0.25 çm	-55 C	125 °C	30 x 30
Preci-Dip 558-10-256M20-001104	10 mOhm	2.2 mm	0.086 in	1 A	UL94 V-0	Gold	Solder	Surface Mount	Gold	0.05 in	1.27 mm	BGA	FR4 Epoxy Glass	1.27 mm	0.05 in		256	Closed Frame	0.25 µm	10 µin	Brass	Brass	10 Áin	0.25 çm	-55 C	125 °C		20	20
Preci-Dip 558-10-456M26-001101	10 mOhm	2.83 mm	0.111 in	1 A	UL94 V-0	Gold	Solder	Through Hole	Gold	0.05 in	1.27 mm	PGA	FR4 Epoxy Glass	1.27 mm	0.05 in			Closed Frame	0.25 µm	10 µin	Beryllium Copper	Brass	10 Áin	0.25 çm	-55 C	125 °C		26	26	456

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	312	$ 57.74
	N/A	0	$ 211.09

Description

General part information

558-10 Series

432 (31 x 31) Pos PGA Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available