558-10 Series

Manufacturer: Preci-Dip

Catalog

PGA SOLDER TAIL 1.27MM

Part	Contact Resistance	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Contact Finish - Mating	Termination	Mounting Type	Contact Finish - Post	Pitch - Post	Pitch - Post	Type	Housing Material	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Material - Post [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]
Preci-Dip 558-10-255M16-001101	10 mOhm	2.83 mm	0.111 in	1 A	UL94 V-0	Gold	Solder	Through Hole	Gold	0.05 in	1.27 mm	PGA	FR4 Epoxy Glass	1.27 mm	0.05 in	16x16	255	Closed Frame	0.25 µm	10 µin	Beryllium Copper	Brass	10 Áin	0.25 çm	-55 C	125 °C
Preci-Dip 558-10-576M30-001104	10 mOhm	2.2 mm	0.086 in	1 A	UL94 V-0	Gold	Solder	Surface Mount	Gold	0.05 in	1.27 mm	BGA	FR4 Epoxy Glass	1.27 mm	0.05 in		576	Closed Frame	0.25 µm	10 µin	Brass	Brass	10 Áin	0.25 çm	-55 C	125 °C	30 x 30
Preci-Dip 558-10-420M26-001104	10 mOhm	2.2 mm	0.086 in	1 A	UL94 V-0	Gold	Solder	Surface Mount	Gold	0.05 in	1.27 mm	BGA	FR4 Epoxy Glass	1.27 mm	0.05 in		420	Closed Frame	0.25 µm	10 µin	Brass	Brass	10 Áin	0.25 çm	-55 C	125 °C
Preci-Dip 558-10-500M30-001104	10 mOhm	2.2 mm	0.086 in	1 A	UL94 V-0	Gold	Solder	Surface Mount	Gold	0.05 in	1.27 mm	BGA	FR4 Epoxy Glass	1.27 mm	0.05 in		500	Closed Frame	0.25 µm	10 µin	Brass	Brass	10 Áin	0.25 çm	-55 C	125 °C		30	30
Preci-Dip 558-10-480M29-001101	10 mOhm	2.83 mm	0.111 in	1 A	UL94 V-0	Gold	Solder	Through Hole	Gold	0.05 in	1.27 mm	PGA	FR4 Epoxy Glass	1.27 mm	0.05 in		480	Closed Frame	0.25 µm	10 µin	Beryllium Copper	Brass	10 Áin	0.25 çm	-55 C	125 °C		29	29
Preci-Dip 558-10-388M26-001101	10 mOhm	2.83 mm	0.111 in	1 A	UL94 V-0	Gold	Solder	Through Hole	Gold	0.05 in	1.27 mm	PGA	FR4 Epoxy Glass	1.27 mm	0.05 in		388	Closed Frame	0.25 µm	10 µin	Beryllium Copper	Brass	10 Áin	0.25 çm	-55 C	125 °C
Preci-Dip 558-10-432M31-001101	10 mOhm	2.83 mm	0.111 in	1 A	UL94 V-0	Gold	Solder	Through Hole	Gold	0.05 in	1.27 mm	PGA	FR4 Epoxy Glass	1.27 mm	0.05 in		432	Closed Frame	0.25 µm	10 µin	Beryllium Copper	Brass	10 Áin	0.25 çm	-55 C	125 °C		31	31
Preci-Dip 558-10-576M30-001101	10 mOhm	2.83 mm	0.111 in	1 A	UL94 V-0	Gold	Solder	Through Hole	Gold	0.05 in	1.27 mm	PGA	FR4 Epoxy Glass	1.27 mm	0.05 in		576	Closed Frame	0.25 µm	10 µin	Beryllium Copper	Brass	10 Áin	0.25 çm	-55 C	125 °C	30 x 30
Preci-Dip 558-10-256M20-001104	10 mOhm	2.2 mm	0.086 in	1 A	UL94 V-0	Gold	Solder	Surface Mount	Gold	0.05 in	1.27 mm	BGA	FR4 Epoxy Glass	1.27 mm	0.05 in		256	Closed Frame	0.25 µm	10 µin	Brass	Brass	10 Áin	0.25 çm	-55 C	125 °C		20	20
Preci-Dip 558-10-456M26-001101	10 mOhm	2.83 mm	0.111 in	1 A	UL94 V-0	Gold	Solder	Through Hole	Gold	0.05 in	1.27 mm	PGA	FR4 Epoxy Glass	1.27 mm	0.05 in			Closed Frame	0.25 µm	10 µin	Beryllium Copper	Brass	10 Áin	0.25 çm	-55 C	125 °C		26	26	456